Air force 17. 1 Small Business Innovation Research (sbir) Phase I proposal Submission Instructions



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2. Chu, Ke, Hong Guo, Chengchang Jia, Fazhang Yin, Ximin Zhang, Xuebing Liang, and Hui Chen. "Thermal Properties of Carbon Nanotube–Copper Composites for Thermal Management Applications." Nanoscale Research Letters. Springer, 9 Mar. 2010. Web. 16 Mar. 2016.

KEYWORDS: Carbon Nanotube-Copper Composite, CNT, High Current, Electrode, Arc Heater, Ampacity, Conductivity


AF171-012

TITLE: Air to Ground Target System for Engineering Based Airborne Electro-Optics Imaging System Performance

TECHNOLOGY AREA(S): Battlespace, Electronics, Sensors

The technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), 22 CFR Parts 120-130, which controls the export and import of defense-related material and services, including export of sensitive technical data, or the Export Administration Regulation (EAR), 15 CFR Parts 730-774, which controls dual use items. Offerors must disclose any proposed use of foreign nationals (FNs), their country(ies) of origin, the type of visa or work permit possessed, and the statement of work (SOW) tasks intended for accomplishment by the FN(s) in accordance with section 5.4.c.(8) of the solicitation and within the AF Component-specific instructions. Offerors are advised foreign nationals proposed to perform on this topic may be restricted due to the technical data under US Export Control Laws. Please direct questions to the AF SBIR/STTR Contracting Officer, Ms. Gail Nyikon, gail.nyikon@us.af.mil.

OBJECTIVE: Develop a ground based target system to enable measurement of sensitivity and spatial resolution of airborne target sensors with long range and full optical spectrum capability.

DESCRIPTION: The current state of existing engineering targets on the Edwards AFB precision impact range area (PIRA) would benefit greatly from innovative technology injection. Such upgrades would fulfill a number of current and future requirements while replacing existing limited capability at the end of its life. Research must be performed on how to implement the current requirements, perform system trade-studies, locating suitable system placement on the range, in addition to manufacturing, installing, protecting, sustaining, maintaining and quantifying the limitations, constraints and characteristics of the installed system. The resolution and sensitivity measurements of interest are modulation transfer function (MTF), relative edge response (RER), signal to noise ratio (SNR), noise equivalent delta temperature and (NEDT) noise equivalent delta radiance (NEDL) and any other objective measurements possible. The analysis tools for the metrics are in development (some already mature) by the 775TS/ENVD engineers, though a deeper understanding of optical remote sensing, radiometry, optical system imaging performance and resolution/sensitivity metrics is required for test setup and data analysis.

Requirements include a target system which allows measurement of sensitivity and resolution (preferable a knife edge). Capability to measure at long and short range, UV to LWIR (100nm to 12µm λ), color capability in the visible spectrum, highly uniform surfaces using the latest technology, fully instrumented for atmospherics, surface temperatures, radiance and turbulence (Cn2), built in protection from the elements, rotatable alignment for solar/lunar/flight path geometry, articulating for long range capability, maintenance schedule and procedures and system performance/limitations quantified.

If successful, this research, development, manufacturing and installation will not only provide a key test and analysis capability for efficient, consistent, repeatable, objective airborne electro-optics system imaging performance for any customer with aircraft optical sensors under test. In addition, the developer shall provide a training package for both 775TS/ENVD discipline engineers as well as Test Pilot School (TPS) students.

PHASE I: Research in this phase should focus on trade studies for realizing the requirements of the system in terms of hardware and software in addition to our 775TS/ENVD engineers gaining additional expertise in optical remote sensing, radiometry, optical system imaging performance, and more.

PHASE II: Research in Phase II should be focused on manufacturing, installation, protection, maintenance, and quantification of system performance of a pre-production prototype.

PHASE III DUAL USE APPLICATIONS: Military Application: This is an enabling target system technology with the potential to provide inputs for airborne electro-optical systems to quantify a number of sensitivity and spatial resolution metrics for test and evaluation of airborne electro-optics systems under test.  It will also be useful as a training tool for engineers and test pilots.


Commercial Application: Research will be equally useful for any airborne or spaceborne electro-optics system.

REFERENCES:

1.  C. Liebmann and M. Bennett, “Electro-Optic System Imaging Performance Developmental Test and Analysis Techniques Test and Evaluation (Have Light)”, USAFTPS-TIM-15B-01, 2016

2.  G. Boreman, “Modulation Transfer Function in Optical and Electro-optical Systems”, ISBN-13: 978-0819441430, SPIE-The International Society for Optical Engineering, 2001

3.  J Silny and L Zellinger, “Radiometric Sensitivity Contrast Metrics for Hyperspectral Remote Sensors”, SPIE-The International Society for Optical Engineering, 2016

KEYWORDS: Airborne, Electro-optics, Infrared, Targets, Modulation Transfer Function, Relative Edge Response, Noise Equivalent Delta Temperature, Noise Equivalent Delta Radiance




AF171-013

TITLE: Next Gen Infrared Emitter Array Packaging

TECHNOLOGY AREA(S): Weapons

OBJECTIVE: Develop a robust, scalable packaging and cooling solution for next generation infrared emitter arrays.

DESCRIPTION: This SBIR topic seeks to explore alternatives for addressing technical challenges in developing a robust, scalable packaging solution for next generation infrared emitter arrays. Advanced arrays will introduce new challenges including interfacing high speed drive electronics to the array through the packaging and removing excess heat from the emitter surface of light emitting diode arrays which are orders of magnitude more sensitive to temperature variations than current resistive arrays. Also, due to their high pixel counts and relatively low efficiency, significantly more power must be provided through the package and subsequent generated heat removed. The packaging approach must be scalable to support arrays ranging from 1024 x 1024 (1K x 1K) pixels at 24 um and 48 um pixel pitch (i.e. ~1” and ~2” square arrays) up to 4K x 4K arrays at 24 um pixel pitch (~ 4” square array). The design must have physical characteristics (size, mass, robustness) to support multiple applications including mounting on dynamic flight motion simulators, cryogenic sensor testing, installed systems test facilities, and system integration labs.

The ability to stimulate advanced infrared weapon and aircraft sensors and seekers with high radiance, high resolution IR imagery of targets, backgrounds, and countermeasures in dynamic hardware-in-the-loop simulation (HITL) and installed systems test facilities (ISTF) is critical in the development, test, and evaluation of those systems. Current IR scene projectors are based on resistive emitter array technology that is approaching physical limits on radiance output, size, frame rates, and pixel density and will likely not provide adequate support for future test and evaluation (T&E) requirements. The current emitter array packaging, originally developed for cryogenic operation, supports 512x512 and 1024x1024 resistive arrays and has proven to be very robust but it is not scalable or suitable to support next generation IR emitter arrays.

Infrared sensor and systems are continually increasing in resolution and capabilities resulting similar increases in T&E requirements. Next generation IR emitter arrays are required to provide higher resolutions, higher radiance output (apparent temperature), and higher frame rates to test these systems. Current generation emitters provide a maximum frame size of 1024x1024 pixels, midwave infrared (MWIR) apparent temperatures of ~600K, 11 bits effective dynamic range, and ~200 Hz frame rates. Active efforts are underway to increase emitter resolution to a minimum of 2048x2048 pixels with an objective of 4096x4096, increase MWIR apparent temperature to 1300K - 3000K, improve dynamic range to 16 bits, and provide frame rates of 1000Hz. This will create challenges for the packaging solution to provide cooling, power, and data to the emitter chips.

It will also not be a one-size fits all requirement - different applications will required emitter arrays of different characteristics, sizes, and possibly different technologies requiring a flexible and scalable solution. Current research and development in IR emitter arrays include both advanced resistive arrays and infrared light emitting diode (LED) arrays. Techniques being investigated to increase resolution (i.e. pixel count) include reducing pixel pitch on monolithic arrays and tiling multiple arrays.

A common, flexible, scalable, and verified packaging concept is required to support continued development and use of advanced emitter arrays. The package design must have provisions for cooling the emitter array, keeping the array under vacuum, and providing power and command/control signals to the array.

PHASE I: Identify key requirements for next gen IR emitter array packaging, develop and evaluate conceptual designs, determine technical feasibility of concepts, and design a follow on development and test program for the most promising concept.  Required deliverables will include reports and briefings documenting the designs and analysis.

PHASE II: Complete design and fabricate prototype array packages using the most promising concepts developed in Phase I.  Evaluate performance of the packages in a relevant environment.  Required deliverables will include reports and briefings on the results of the experiments.

PHASE III DUAL USE APPLICATIONS: Military Applications:  DT&E of IR guided weapons, threat warning and aircraft self-protection systems, electro-optical sensors.  Commercial Applications:  DT&E of IR sensors and systems including autonomous guidance, vision, and collision avoidance systems.

REFERENCES:

1. Norton, Dennis, et al., "Development of high-definition IR LED scene projector." Proc. SPIE 9820, Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXVII, 98200X, 3 May 2016.

2. Norton, Dennis Thomas Jr. "Type-II InAs/GaSb superlattice LEDs: applications for infrared scene projector systems." PhD thesis, University of Iowa, 2013.

3. Lange, Corey Wyatt. "Design and Development of 512 512 Infrared Emitter Array System." Master's thesis, University of Delaware, 2011.

4. Franks, Greg, et al. "Development of an Ultra-High Temperature Infrared Scene Projector at Santa Barbara Infrared Inc." Proc. SPIE 9452, Infrared Imaging Systems:  Design, Analysis, Modeling, and Testing XXVI, 94520W, 12 May 2015.

5. James, Jay, et al, "OASIS: Cryogenically-Optimized Resistive Array & IRSP Subsystems for Space-Background IR Simulation." Proc. SPIE 6544, Technologies for Synthetic Environments:  Hardware-in-the-Loop Testing XII, 654405,24 Apr 2007.

KEYWORDS: Extraction, efficiency, Light, emitting, diode, LED, infrared, emitter, array, mid-wave, MWIR, long-wave, LWIR, hardware-in-the-loop, HITL, resistive, array, scene, projector, IRSP, Optoelectronics, tiling, quilting, scalable, cryogenic, electronics, pack




AF171-014

TITLE: Dynamic Aircraft Tire Footprint Sensor (DATFS)

TECHNOLOGY AREA(S): Air Platform

OBJECTIVE: Develop a dynamic aircraft tire measurement system capable of tire footprint property measurement; integrated with internal drum dynamometer. Support aircraft loads and speeds with continuous measurements of all types of tire footprint properties.

DESCRIPTION: In military/commercial aircraft tires, tire tread life and stopping performance are greatly dependent on the tire dynamic contact surface profile. While the tire is rotating, portions of the tire profile will be slipping while other parts will be rolling in relation to the contact surface. Thus, the measurement of slip velocities during this process can create a large insight into tire life issues and improving antilock braking performance. Additionally, the added ability to capture and characterize contact stresses between the tire runway interface contract region, at a given angular position, may support performance/service life improvements and tire re-designs to improve tire life and improve tire responses during antilock braking. These improvements would significantly affect the large costs of poor performing tires and potentially improve stopping performance, which is always a critical safety-of-flight (SOF) concern.

Current T&E tire test machine envisioned for this effort is the 96th Test Group’s Landing Gear Test Facility (LGTF) 168-inch internal drum dynamometer (168i). This machine can apply a vertical force up to 150,000 lbs with camber (±10 degrees) and yaw (±20 degrees) for tests up to 350 mph. The machine is fully dynamic and can simulate all aspects of actual aircraft missions including touchdown, high-speed braking, takeoff, etc. There are currently no existing measurement methods to determine tire profile contact forces and slip velocities at high aircraft-related speeds. Therefore, a new measurement technology is required to obtain all pertinent information at the interface contact region between the tire and surface. Different surfaces have been installed and used on the 168i (including concrete runway), thus there would be space (appx 3 in thick and 2.5 feet wide) to retrofit an assembly to measure the contact forces. Additionally, there are also possibilities of developing a standalone unit for this system. This unit, however, would need to show it can hold a tire and subject the tire to controlled load, speeds, and other aspects that an internal drum dynamometer is capable of.

The new measurement system should be designed to provide real-time, continuous measurement of contact stress variations (both the normal and shear forces at the tire-runway interface), slip velocity, and footprint properties for high-speed (350 mph) dynamic tire tests while at loads up to 150,000 lbs. To minimize error and improve the accuracy and fidelity of current technology, the measurement system should introduce minimal test article interference. This measurement system must be capable of accurate and precise operation. The goal is to continually measure all of this information for a variety of dynamic simulated landing missions with speeds up to 250 mph. The system should be able of testing tires up to 60” in diameter, and 30” in width.

No other commercially-available system provides these capabilities. There have been systems developed for static, or quasi-static testing. However, to date there is no technology that acquires these high-speed slip, tire footprint, and shear stress measurements. The Air Force envisions four levels of success in the program.

PHASE I: Demonstrate feasibility of DATFS with minimal test article interference to determine all pertinent dynamic tire footprint properties listed above.  Explore tradeoffs relating to measurement area, spatial resolution, sensitivity, and dynamic response. The dynamic response will be key, due to the inherent hysteretic properties of some materials.

PHASE II: Develop full-scale demonstrator of DATFS that is applicable to aircraft tire loads and operating environment.  Demonstrate sensor test repeatability with less than 5% error.  Demonstrate automated data acquisition with data able to be imported into finite element models.  Demonstrate capability to the sensor results and how the tire footprint properties are changing with different test conditions.  Deliver final prototype sensor to 96 TG LGTF and demonstrate potential with 168i or similar.

PHASE III DUAL USE APPLICATIONS: Military applications: Develop final sensor.  Show utilization of data for tire life and antiskid.  Commercial applications:  A test system for airlines, automotive, truck, and heavy equipment and test facilities.  Original equipment manufacturers (OEMs) expressed interest to assist tire life and potential antilock improvements.

REFERENCES:

1. Crane, D.  "Aircraft Tires and Tubes," Second Edition, an Aviation Maintenance Publishers, Inc.  Training Manual, EA-ATT-2, 1980.

2. Castillo, J., Blanca, A. Prez De la, Cabrera, J. A., Simm, A. An optical tire contact pressure test bench, Vehicle System Dynamics, 44 (3): pp. 207-221(15), 2006

3. Fonov, S., Jones, G., Crafton, J., Fonov, V., Goss, L.  The development of optical techniques for the measurement of pressure and skin friction, Measurement Science and Technology, 16: pp. 1-8, 2005.

4. McClain, J.G., Vogel, M., Pryor D. R., Heyns, H.E.  The United Air Force Landing Gear Systems Center of Excellence A Unique Capability, AIAA, 2007-1638.

5. Zakrajsek, Andrew J., Childress, Jonathan M., Bohn, Michael H., et al.  "Aircraft Tire Spin-Up Wear Analysis through Experimental Testing and Computational Modeling."  57th AIAA/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference.

KEYWORDS: Dynamic Slip Velocities in Tires, Tire Contact Profile, Tire Life, Tire Wear, Dynamic Testing, Aircraft Tire, Footprint Properties, Normal and Shear Contact Interface Pressure, Dynamic Interface Pressure, Flight Line, Aircraft, Maintenance Checks, Cost Re


AF171-015

TITLE: Infrared Light Emitting Diode Extraction Efficiency

TECHNOLOGY AREA(S): Weapons

OBJECTIVE: Develop technologies to improve extraction efficiency of high density infrared light emitting diode arrays to improve radiance output, self-heating, and wall-plug efficiency.

DESCRIPTION: This SBIR topic seeks to identify and demonstrate technologies that can improve the light extraction efficiency of high density mid-wave infrared (MWIR) and long wave infrared (LWIR) light emitting diode (LED) arrays designed to be used in infrared (IR) scene projectors without affecting the ability to control the radiance on a per-pixel level. The enhancements must be applicable for incorporation into projector systems suitable for use in hardware-in-the-loop (HITL) simulation and Installed System Test Facility (ISTF) applications.

The ability to stimulate advanced infrared weapon and aircraft sensors and seekers with high radiance, high resolution IR imagery of targets, backgrounds, and countermeasures in dynamic hardware-in-the-loop simulation and installed systems test facilities is critical in the development, test, and evaluation of those systems. Current IR scene projectors are based on resistive emitter array technology that has numerous limitations including output radiance, frame rates, and frame size.

Infrared (IR) LED arrays have shown great potential for application to advanced IR scene projectors. LED arrays may improve radiance levels, operating speed, and frame size over other existing technologies. Developmental LED arrays range from 512x512 pixels on a 48 micron pixel pitch (~1 inch square array) to 2048x2048 arrays on a 24 micron pitch (~2 inch square array) with potential growth to larger arrays. The LED arrays are driven by a read-in integrated circuit (RIIC) which provides control of the radiance output of each pixel based on the desired IR image from a scene generation system and the ability to provide non-uniformity correction across the array.


A significant issue with current generation IR LED arrays is the light extraction efficiency (LEE) which is typically less than 1%. Even slight improvements to the LEE would greatly increase maximum radiance, reduce waste heat which must be removed from the arrays, and increase wall-plug efficiency. An example is a 512x512 superlattice LED array with about 1% extraction efficiency where each pixel at full power consumes 15 milliamps at 12 volts. If all quarter million pixels were turned on, the one inch square array would be required to dissipate 47 kW.

The low efficiency significantly impairs the utility of the LED arrays. Not only does the reduced radiance limit the types of imagery that can be projected, a very large amount of waste heat is generated that, even with extensive cooling, can affect operation of the array and even permanently damage the devices.

PHASE I: Identify factors that limit extraction efficiency, define concepts that may increase the efficiency, determine the technical feasibility of the concepts, and design a follow-on test program for the most promising concepts.  Required deliverables will include reports and briefings documenting the analysis and the results

PHASE II: Complete design and fabricate small prototype IR LED arrays using the most promising concepts developed in Phase I.  Perform characterization experiments quantifying the effects on extraction efficiency and on overall LED performance including output radiance, self-heating, and wall-plug efficiency.  Required deliverables will include reports and briefings on the results of the experiments.

PHASE III DUAL USE APPLICATIONS: Military Applications:  DT&E of IR guided weapons, threat warning and aircraft self-protection systems, electro-optical sensors.  Commercial Applications:  DT&E of IR sensors and systems including autonomous guidance, vision, and collision avoidance systems.

REFERENCES:

1. Norton, Dennis Thomas Jr.  "Type-II InAs/GaSB superlattice LEDs:  applications for infrared scene projector systems."  PhD thesis, University of Iowa, 2013.

2. Norton, Dennis, et al., "Development of a high-definition IR LED scene projector."  Proc.  SPIE 9820, Infrared Imaging Systems:  Design, Analysis, Modeling, Testing XXVII, 98200X, 3 May 2016.

3. Lange, Corey Wyatt.  "Design and Development of 512 512 Infrared Emitter Array System." Master's thesis, University of Delaware, 2011.

KEYWORDS: Extraction, efficiency, Light, emitting, diode, LED, infrared, emitter, array, mid-wave, MWIR, long-wave, LWIR, hardware-in-the-loop, HITL, scene, projector, IRSP, Optoelectronics.




AF171-016

TITLE: Efficient On-Board Fire Suppression

TECHNOLOGY AREA(S): Air Platform

OBJECTIVE: Efficiently and economically suppress on-board aircraft fires using a non-toxic and non-corrosive agent while balancing cost/logistics burdens.

DESCRIPTION: Halon is a highly effective fire suppression agent that remains in-use on many legacy military vehicles. In 1987, Halon production phased out with signature of the Montreal Protocol (an international treaty banning further production of such ozone-depleting substances). Since then, a search for equally effective agents has been on-going. Alternative solutions have proven less capable and often with burdens of higher cost, volume, and weight; greater toxicity and corrosiveness; and greater or unique logistics challenges. The present SBIR topic takes a renewed search for novel solutions first by concentrating on designing, producing, and demonstrating effectiveness of a fire suppression agent that is environmentally safe and has few logistics challenges. Effectiveness is judged based on the least amount of agent weight/volume to extinguish a given fire. Goal is to obtain effectiveness on par with Halon. The present SBIR then continues by marrying the proposed agent to an on-board fire suppression system. Teaming with (or consulting with) an aircraft manufacturer is encouraged to ensure aircraft suitability.


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