Benefit
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Highest quality
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Robust
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Standard Babyface pinning
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Data transfer rate: 115 kbit/s
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Distance range > 1 m can be reached to
3 m
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Best cost/performance ratio
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Tj 175 °C
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Repetitive avalanche energy, EAR 280 mJ
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Low Qg
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Low Rds (on)
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SUP60N10-16L 16 mohm, 60 A
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SUP85N10-10 10 mohm, 85 A
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Low breakdown voltages for low-voltage post-regulation environments provide industry best on-resistance times gate change products, resulting in lower switching and conduction losses and thus higher efficiency dc-to-dc circuits
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By reverse forming the leads of a DPAK, the packages can be mounted inversely so a heat sink can be mounted on top. The heat sink allows the device to operate cooler, lowering effective on-resistance and allowing higher current capability.
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It allows the board to operate cooler and undergo less thermal stress for better reliability.
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Space and cost is saved when less MOSFETs are used.
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