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Annex B to JCT-VC report: List of meeting participants



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Annex B to JCT-VC report:
List of meeting participants


The participants of the thirteenth meeting of the JCT-VC, according to a sign-in sheet circuated during the meeting (approximately 162 people in total), were as follows:


  1. Elena Alshina (Samsung Electronics)

  2. Peter Amon (Siemens AG)

  3. Kenneth Andersson (LM Ericsson)

  4. Ichiro Ando (Nikon)

  5. Kohtaro Asai (Mitsubishi Electric)

  6. Cheung Auyeung (Sony)

  7. Gun Bang (ETRI)

  8. Guillaume Barroux (Fujitsu)

  9. Philippe Bordes (Technicolor)

  10. Frank Bossen (Docomo Innovations)

  11. Jill Boyce (Vidyo)

  12. Benjamin Bross (Fraunhofer HHI)

  13. Madhukar Budagavi (Texas Instruments)

  14. Done Bugdayci (Nokia)

  15. Yu-Lin Chang (MediaTek USA Inc.)

  16. Chun-Chi Chen (NCTU/ITRI)

  17. Jianle Chen (Qualcomm)

  18. Peisong Chen (Broadcom)

  19. Yi-Wen Chen (MediaTek)

  20. Yongjin Cho (Samsung Electronics Co., Ltd)

  21. Yoonsik Choe (Yonsei Univ.)

  22. Byeongdoo Choi (Samsung Electronics)

  23. Jangwon Choi (Yonsei University)

  24. Keiichi Chono (NEC)

  25. Takeshi Chujoh (Toshiba)

  26. Robert Cohen (Mitsubishi Electric Res. Labs)

  27. Davy De Schryver (Cisco Systems)

  28. Sachin Deshpande (Sharp)

  29. Alexey Dolgoborodov (Vanguard Software Solutions)

  30. Alberto Duenas (NGcodec)

  31. MyungJin Eom (Samsung Electronics)

  32. Christian Feldmann (RWTH Aachen University)

  33. Felix Fernandes (Samsung Telecom. America)

  34. Alexey Filippov (Huawei)

  35. David Flynn (Research In Motion)

  36. Chad Fogg (Harmonic)

  37. Edouard François (Canon CRF)

  38. Arild Fuldseth (Cisco Systems Norway)

  39. Christophe Gisquet (Canon Research)

  40. Dan Grois (Fraunhofer HHI)

  41. Miska Hannuksela (Nokia)

  42. Ryoji Hashimoto (Renesas Electronics)

  43. Shinobu Hattori (Sony)

  44. Dake He (Blackberry)

  45. Yong He (InterDigital Commun.)

  46. Félix Henry (Orange Labs)

  47. Jin Heo (LG Electronics)

  48. Hideo Hoshuyama (Nikon)

  49. Yu-Wen Huang (MediaTek USA Inc.)

  50. Walt Husak (Dolby Labs)

  51. Atsuro Ichigaya (NHK)

  52. Tomohiro Ikai (Sharp)

  53. Byeongmoon Jeon (LG Electronics)

  54. Byeungwoo Jeon (Sungkyunkwan Univ. (SKKU))

  55. Rajan Joshi (Qualcomm)

  56. Jung Won Kang (ETRI)

  57. Mukta L. Kar (Cable Television Labs)

  58. Kei Kawamura (KDDI)

  59. Kimihiko Kazui (Fujitsu Labs)

  60. Hui Yong Kim (ETRI)

  61. Woo-Shik Kim (Qualcomm)

  62. Peter Kuhn (European Patent Office)

  63. Do-Kyoung Kwon (Texas Instruments)

  64. Jani Lainema (Nokia)

  65. Bae-Keun Lee (KT)

  66. Gyoyoon Lee (LG Electronics)

  67. Hahyun Lee (ETRI)

  68. Jae Yung Lee (Sejong Univ.)

  69. Jinho Lee (ETRI)

  70. Sunil Lee (Samsung Electronics)

  71. Yung-Lyul Lee (Sejong Univ.)

  72. Shawmin Lei (MediaTek USA)

  73. Ming Li (ZTE)

  74. Xiang Li (Qualcomm Technologies)

  75. Chongsoon Lim (Panasonic)

  76. Jian-Liang Lin (MediaTek USA)

  77. Youyao Lin (Tencent)

  78. Shan Liu (MediaTek USA)

  79. Xiaoyu Liu (Tencent)

  80. Yiqun Liu (Leibniz Univ. Hannover)

  81. Ajay Luthra (Arris)

  82. Zhan Ma (Huawei)

  83. Gaëlle Martin-Cocher (Research in Motion)

  84. Shohei Matsuo (NTT)

  85. Ken McCann (Zetacast / Samsung)

  86. Akira Minezawa (Mitsubishi Electric)

  87. Koohyar Minoo (Arris)

  88. Marta Mrak (BBC R&D)

  89. Tokumichi Murakami (Mitsubishi Electric)

  90. Matteo Naccari (BBC R&D)

  91. Takayuki Nakachi (NTT)

  92. Ohji Nakagami (Sony)

  93. Hiroya Nakamura (JVC Kenwood)

  94. Junghak Nam (Kwangwoon Univ.)

  95. Sam Narasimhan (Motorola)

  96. Nguyen Nguyen (Research in Motion)

  97. Tung Nguyen (Fraunhofer HHI)

  98. Takahiro Nishi (Panasonic)

  99. Andrey Norkin (Ericsson AB)

  100. Jens-Rainer Ohm (RWTH Aachen Univ.)

  101. Wen-Hsiao Peng (NCTU/ITRI)

  102. Martin Pettersson (Ericsson)

  103. Adarsh Krishnan Ramasubramonian (Qualcomm Technologies)

  104. Krishnakanth Rapaka (Qualcomm Technologies)

  105. Justin Ridge (Nokia)

  106. Christopher Rosewarne (CiSRA / Canon Inc)

  107. Dmytro Rusanovskyy ()

  108. Yago Sanchez (Fraunhofer HHI)

  109. Hisao Sasai (Panasonic)

  110. Nicholas Saunders (Sony Europe Broad. & Prof. Res. Labs)

  111. Ankur Saxena (Samsung Telecom. America)

  112. Thomas Schierl (Fraunhofer HHI)

  113. Shun-ichi Sekiguchi (Mitsubishi Electric)

  114. Vadim Seregin (Qualcomm)

  115. Karl Sharman (Sony Europe Broad. & Prof. Res. Labs)

  116. Masato Shima (Canon)

  117. Shinya Shimizu (NTT)

  118. John Sievers (LifeSize Commun.)

  119. Rickard Sjöberg (Ericsson)

  120. Robert Skupin (Fraunhofer HHI)

  121. Joel Sole (Qualcomm Technologies)

  122. Kazuo Sugimoto (Mitsubishi Electric)

  123. Shiori Sugimoto (NTT)

  124. Karsten Sühring (Fraunhofer HHI)

  125. Gary Sullivan (Microsoft)

  126. Teruhiko Suzuki (Sony)

  127. Maxim Sycher (Huawei)

  128. Yasser Syed (Comcast)

  129. Ali Tabatabai (Sony)

  130. Seishi Takamura (NTT)

  131. Thiow Keng Tan (NTT Docomo)

  132. Yih Han Tan (Inst. Infocomm Res. (I2R))

  133. Biatek Thibaud (TDF)

  134. Herbert Thoma (Fraunhofer IIS)

  135. Alexandros Tourapis (Apple)

  136. Yi-Shin Tung (ITRI USA / MStar Semiconductor)

  137. Kemal Ugur (Nokia)

  138. Geert Van der Auwera (Qualcomm Technologies)

  139. Glenn Van Wallendael (Ghent University - iMinds)

  140. Thijs Vermeir (Barco)

  141. Anthony Vetro (Mitsubishi Electric Res. Labs)

  142. Ye-Kui Wang (Qualcomm Technologies)

  143. Hamiclouche Wassim (IETR/INSA)

  144. Stephan Wenger (Vidyo)

  145. Thomas Wiegand (Fraunhofer HHI)

  146. Mathias Wien (RWTH Aachen Univ.)

  147. Ping Wu (ZTE UK)

  148. Xiaoyu Xiu (InterDigital Commun.)

  149. Jizheng Xu (Microsoft)

  150. Tomoyuki Yamamoto (Sharp)

  151. Haitao Yang (Huawei)

  152. Yan Ye (InterDigital Commun.)

  153. Chuohao Yeo (Inst. Infocomm Res. (I2R))

  154. Haoping Yu (Huawei USA)

  155. Jinwen Zan (Huawei)

  156. Louis (Lei) Zhang (AMD)

  157. Wen Zhang (Tencent)

  158. Wenhao Zhang (Intel)

  159. Jianhua Zheng (Huawei)

  160. Yunfei Zheng (Apple)

  161. Minhua Zhou (Broadcom)

  162. Wenjing Zhu (Hong Kong Univ. Sci. & Tech.)



  1. JCT-3Vreport

Source:JensOhmandGarySullivan,Chairs
Summary

The Joint Collaborative Team on 3D Video Coding Extension Development (JCT-3V) of ITU-T WP3/16 and ISO/IEC JTC 1/ SC 29/ WG 11 held its fifth meeting during 27 July – 2 Aug. 2013 at the Event Hotel Pyramide, Vösendorf, Vienna, AT. The JCT-3V meeting was held under the chairmanship of Dr Jens-Rainer Ohm (RWTH Aachen/Germany) and Dr Gary Sullivan (Microsoft/USA). For rapid access to particular topics in this report, a subject categorization is found (with hyperlinks) in section 15.14 of this document.

The meeting was mainly held in a “single track” fashion, with few breakout activities (as documented in this report) held in parallel. Several plenary sessions were chaired by Dr Anthony Vetro or Dr Karsten Müller, particularly in cases when neither of the two chairs was able to attend due to commitments in other groups or joint meetings. It was usually avoided to make decisions which might cause objections in such cases.

The JCT-3V meeting sessions began at approximately 0900 hours on Saturday 27 July 2013. Meeting sessions were held on all days until the meeting was closed at approximately 1310 hours on Friday 2 Aug. Approximately 107 people attended the JCT-3V meeting, and approximately 300 input documents were discussed. The meeting took place in a collocated fashion with a meeting of WG11 – one of the two parent bodies of the JCT-3V. The subject matter of the JCT-3V meeting activities consisted of work on 3D extensions of the Advanced Video Coding (AVC) and the High Efficiency Video Coding (HEVC) standards.

The AHG on 3D High-level Syntax (AHG7) had met during the 2 days before the JCT-3V meeting (25-26 July), to discuss HEVC High-Level Syntax (HLS) input contributions jointly with JCT-VC experts. The outcome of these joint discussions, which continued after the beginning of the JCT-3V meeting, is documented in the JCT-VC report JCTVC-N1000.

The primary goals of the meeting were to review the work that was performed in the interim period since the fourth JCT-3V meeting in producing



  • The sixth version of specification Draft of the AVC 3D extension framework (3D-AVC, which had been issued for JTC 1 ballot as an ISO/IEC DAM);

  • The sixth test model of the AVC 3D extension framework (3D-AVC), and associated software;

  • The fourth version of draft text of the Multiview HEVC extension (MV-HEVC), which had been issued as an ISO/IEC 23008-2/PDAM2 study document;

  • The fourth test model of the HEVC 3D extension framework (3D-HEVC) and associated software;

  • The third Draft of MVC plus depth conformance specification, which had been issued for JTC 1 ballot as ISO/IEC 14496-4:2004/DAM41;

  • The first draft of the MVC plus depth reference software specification, which had been issued for SC 29 ballot as ISO/IEC 14496-5:2001/PDAM33;

  • The first draft for 3D-AVC conformance specification;

  • The third Draft of Multi-resolution Frame Compatible Stereo (MFC), which had been issued JTC 1 ballot as ISO/IEC 14496-10:2012/DAM5;

  • The first test model and associated software of MFC.

Furthermore, the JCT-3V reviewed the results from the interim Core Experiments (CE); reviewed technical input documents; produced updated versions of the draft texts, framework descriptions and software implementations of the items above; and planned a new set of Core Experiments (CEs) for further investigation of proposed technology.

The JCT-3V produced 12 particularly important output documents from the meeting:



  • Draft Text 7 of 3D-AVC (Study of ISO/IEC 14496-10:2012/DAM3 – not for ballot)

  • Test Model 7 of 3D-AVC, and associated software

  • Draft Text 5 of MV-HEVC (ISO/IEC 23008-2:200X/DAM 2– for ballot)

  • Test Model 5 of 3D-HEVC (includes MV-HEVC as subset), and associated software

  • Draft 1 of 3D-HEVC text specification

  • Draft 4 of MVC plus Depth Conformance (Study of ISO/IEC 14496-4:2004/DAM 41 – not for ballot)

  • Draft 2 of MVC plus Depth Reference Software (Study of ISO/IEC 14496-5:2001/PDAM 33 – not for ballot)

  • Draft 2 of 3D-AVC Conformance

  • Draft 1 of MFC Conformance (ISO/IEC 14496-4:2004/PDAM 42 –for ballot)

  • Draft 1 of MFC Reference Software (ISO/IEC 14496-5:2001/PDAM 34 –for ballot)

  • Test Model 2 of Multi-resolution Frame Compatible Stereo

  • 3D Video Subjective Quality Assessment Test plan

  • Common Test Conditions of 3DV Core Experiments

Moreover, plans were established to conduct 5 future CEs in the interim period until the next meeting.

It was emphasized that a short editing period would apply to have the DAM ballot result for MV-HEVC available by the time of the January 2014 meeting.

For the organization and planning of its future work, the JCT-3V established 15 "Ad Hoc Groups" (AHGs) to progress the work on particular subject areas. The next four JCT-3V meetings are planned for 26 Oct– 01 Nov. 2013 under ITU-T auspices in Geneva, CH, 11–17 Jan. 2014 under WG 11 auspices in San Jose, US, 29 March – 4 April 2014 under WG 11 auspices in Valencia, ES, 3 – 9 July 2014 under ITU-T auspices in Sapporo, JP.

The document distribution site http://phenix.it-sudparis.eu/jct3v/ was used for distribution of all documents.

The reflector to be used for discussions by the JCT-3V and all of its AHGs is jct-3v@lists.rwth-aachen.de.



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