March 2016 doc.: Ieee 802. 11-16/0293r1 ieee p802. 11



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Chair’s action: I’ll take an action to determine the time of a response.

  • Chair: I suggest an ad-hoc group to deal with this and several people who are willing to take part. Please can you organize yourselves and come back on Friday with the next steps.




    1. Legacy Element ID allocation for ESP (11-16-0442r1)




      1. This presentation discusses an element ID allocation for ESP.

      2. Q: How many ANA reserved numbers are there?

      3. Chair: I’m not sure about that.

      4. C: The number is roughly about 11, I think.

      5. Chair: I’ll research the exact number for Friday.

      6. C: It would be better to know now please.

      7. Chair: I’ll recess the meeting for a couple of minutes.

      8. Chair: There are 236 allocated, and there are 12 available, with 6 reservations.

      9. C: I think that this number is quite low, so can we do something else please for this particular value?

      10. C: I don’t mind having the extended element ID instead.

      11. C: No, I meant re-using an existing ID.

      12. Move to instruct ANA to assign a legacy element ID for the Estimated Service Parameter Information element.

        1. Moved by: Matthew Fischer, Seconded by: Chris Hansen

        2. C: I thought we were concerned about beacon bloat. I agree that this is a precious resource and not be squandered.

        3. VC1: The motion is about assigning the legacy element ID.

        4. Chair: I don’t think so.

        5. For: 10, Against: 17, Abstain: 81 (Motion fails)

      13. C: I’d like to amend the motion please.

      14. Chair: for extended element IDs, you don’t need a motion.




    1. Legacy Element ID allocation for UPSIM (11-16-0224r0 slide #8)




      1. This presentation discusses an element ID allocation for UPSIM.

      2. Q: Are existing implementations assuming this allocation already?

      3. A: It should say ‘future’ on the slide, as opposed to ‘Feature’.

      4. C: So, it shouldn’t really matter whether it is an element ID or an extended element ID

      5. Move to instruct ANA to assign a legacy element ID for the UPSIM element.

        1. Moved by: Payam Torab, Seconded by: Alecsander Eitan

        2. C: I don’t think this is necessary

        3. C: This element does not currently exist.

        4. For: 19, Against: 10, Abstain: 61 (Motion passes)

        5. C: Is the chair asking whether members feel that it is procedures or technical

        6. Chair: Are you appealing to the chair’s ruling?

        7. C: yes.

        8. Move to appeal the chair’s ruling.

        9. (Note: This motion if passed means that the original motion was technical, not procedural, as stated by the chair)

          1. Moved: Mark Rison, 2nd; Stuart Kerry.

          2. Chair: I believe that the motion was asking someone to perform an action.

          3. C: I believe that the motion was asking for a technical decision about the allocation of a 1 or 2 octet.

          4. C: However, most of our motions tend to ask someone to do something and follow the format of the original motion.

          5. C: I call for orders of the day.

          6. Chair: Will you give me the indulgence of asking the question first?

          7. C: yes.

          8. For: 16, Against: 42, Abstain: 20 (Chair’s decision not sustained)

        10. Chair: So the previous motion needs to be now reconsidered as a technical motion. Therefore, that motion fails.




    1. Agenda finished




      1. Meeting finished at 12:34 CST

    Friday, 18th March 2016
    IEEE 802.11 Closing Plenary
    Call to order at 08:03 CST by Adrian STEPHENS (Intel Corporation).
    69 people present in the room.


    1. Agenda (11-16-0214r6)




      1. Chair: Since the previous version, I’ve added an agenda item to allow a response to the 3GPP liaison be considered and a few items about regulatory issues.

      2. Move to approve the agenda in document 11-16-0214r6

      3. Moved: Edward Au, Second: Jon Rosdahl

      4. No objections, so moved and approved.




    1. Call for Essential Patents




      1. The meeting is still operating the P&Ps as described on Monday

      2. Call for Essential Patents and Letters of Assurance (LoA)

      3. None




    1. Announcements (11-16-0216r3)




      1. Minutes and documents

        1. Please can everyone remember that minutes, should be completed within 30 days, once the meeting is closed.




      1. Preparation for May 2016

        1. There is currently a draft agenda for the January 2016 meeting and there will be our usual CAC teleconference meetings between now and that meeting, on April 11th 2016 and May 9th 2016 noon ET.




      1. LoA (slide #22)

        1. Chair: Please note that there are two outstanding LoAs as shown on the slide.

        2. No questions




      1. IEEE Store (slide #23)

        1. Chair: everything is currently up to date.

        2. No questions




      1. ISO/IET JTC1/SC6 (slide #24)

        1. This slide shows the drafts, which will be shared with ISO. REVmc D5.0 has now been liaised.




      1. Liaison response to 3GPP (11-16-0489r1)

        1. This is a liaison response to 3GPP regarding LWA and LWIP. It is a polite thank you and encourage for further co-operation.

        2. C: Please can you also add the 3GPP administration secretary on the “To:” line at the top.

        3. C: …and also 3GPP SA?

        4. Chair: yes, we can add those as editorial updates.

        5. C: in particular, 3GPP SA2

        6. Chair: I’d like to thank Stephen Palm for working on this last night and we’ll have the motion now as he needs to depart early.




      1. Motion: Liaison to 3GPP (11-16-0224r3 slide #12)

        1. Move to approve the liaison in document 11-16-0489r1, granting the chair editorial license.

        2. Moved: Stephen Palm, Seconded: Joseph Levy

        3. For: 49, Against: 0, Abstain: 4 (Motion passes)




    1. Meeting Location (11-16-0246r2) slide #24




      1. VC1: Can I have a show of hands to see who is in favor of returning to this location again?

      2. For: 31, Against: 19

      3. No questions




    1. Future Venues (11-16-0246r2, slides #25, #26)




      1. VC1: The next wireless interim is in May 2016, in Waikoloa, Hawaii, USA

      2. The others are as shown on the slide.

      3. Q: Will the China meeting in November 2018 be behind the so called “China firewall”?

      4. A: Yes.

      5. C: Ok, I find that a problem.




    1. Timeline Update




      1. There are changes to the following timelines: TGah. The timeline chart will be updated shortly.




    1. Attendance (11-16-0225r0 slide #5)




      1. Chair: The attendance is shown in the slide desk. TGax has been the main group this week, as it has met in nearly every slot.

      2. Chair: 37% of attendees are from the US, with China, Japan and Korea following.

      3. Q: Perhaps you could add the regulatory group to slide #4 please.

      4. Chair: It doesn’t appear as the percentage is too small.




    1. WG Committee Reports (11-16-0225r0)




      1. Technical editor (slide #7)

        1. There is a now an editor for each task group.

        2. Slide #9 discusses a new amendment style that the editors are trying to adopt.

        3. No questions




      1. ARC SC (slide #14)

        1. No questions




      1. PAR SC (11-16-0247r3)

        1. VC1: These are the various comments compiled by IEEE 802.11 regarding PARs from other IEEE 802 this week.

        2. It was noted that the “MyProject” field, in the online form, has been causing issues for some of the other WGs.

        3. No questions




      1. Regulatory SC (11-16-0225r0 slide #22)

        1. This group is now operating under a new relationship with IEEE 802.18 and proposed some inputs to that TAG.

        2. There were many issues discussed as shown on slide #23.

        3. No questions




      1. WNG SC (slide #28)

        1. There were two presentations this week for WNG SC:

          1. Visible light communications for IEEE 802.11

          2. 3GPP liaison about IEEE 802.11 and LWA/LWIP.

        2. No questions




      1. IEEE 802 JTC1 SC (slide #32)

        1. No questions




      1. TGmc (slide #36)

        1. Currently looking at September 2016 for final publication of the revision draft.

        2. There will be a BRC (Ballot Resolution Committee) face to face meeting during the week of April 25th 2016 in Cambridge UK.

        3. No questions




      1. TGah (slide #43)

        1. Within the task group, there was a motion to have a 15-day sponsor re-circulation ballot.

        2. No questions




      1. TGaj (slide #48)

        1. Current plan is to have a re-circulation ballot on D2.0 at the May 2016 interim meeting, where TGaj will also be meeting.

        2. No questions




      1. TGak (slide #60)

        1. No questions




      1. TGaq (slide #63)

        1. No questions




      1. TGax (slide #68)

        1. The task group has approved to start a 21-day comment collection process on D0.1, which will start next week.

        2. No questions




      1. TGay (slide #74)

        1. No questions




      1. TGaz (slide #79)

        1. No questions




      1. LRLP TIG (slide #84)

        1. No questions




    1. Liaison Reports




      1. IEEE 802.15 (11-16-0494r0)

        1. Q: What’s the purpose of the ULI (Upper Layer Interface) SG?

        2. A: It’s for adapting 802.15.4 to possibly allow IP to run over 802.15.4 technologies.




      1. IEEE 802.21 (11-16-0491r0)

        1. No questions




      1. IEEE 802.18 (11-16-0490r0 and 11-16-0225r0 slide #93)

        1. In addition to the liaison report, this presentation includes a summary of the OfCom report presented to IEEE 802.18 (18-16-0016) that is very important to IEEE 802.

        2. No questions




      1. IEEE 802.19 (11-16-0225r0 slide #140)

        1. It’s interesting to note that a Liaison to 3GPP related to LAA was approved.

        2. No questions




      1. IEEE 802.24 (11-16-0225r0 slide #143)

        1. No questions




      1. IEEE 802.1 OmniRAN (11-16-0225r0 slide #146)

        1. The next face to face meeting will be with IEEE 802.1 in Budapest in May and not in Hawaii.

        2. No questions




    1. Coffee Break




      1. Chair: At this point, I’d like to know if anyone wishes to have a coffee break.

      2. The majority indicated no




    1. EC 5G SC report (11-16-0455r0)




      1. This is a report about the EC 5G standing committee. It met for about 5 hours this week.

      2. No questions




    1. Working Group Motions (Old Business) (11-16-0224r2)




      1. Teleconferences (slide #13)

        1. Move to approve the following teleconferences





        1. Moved Stephen McCann, 2nd Mike Montemurro

        2. No objection to approving by unanimous consent.




      1. TGaq Re-circulation Letter Ballot Motion (slide #14)

        1. Having approved comment resolutions for all of the comments received from LB216 on 11aq D3.0 as contained in document 11-15-1377r15, instruct the editor to prepare 11aq D4.0 incorporating these resolutions and

        2. Approve a 15 day Working Group Technical Recirculation Letter Ballot asking the question “Should 11aq D4.0 be forwarded to Sponsor Ballot?”

        3. Moved: Stephen McCann on behalf of the TGaq

        4. For: 51, Against: 0, Abstain: 3 (Motion passes)




    1. Ballot abstain reasons (11-16-0223r1)




      1. VC2: This is about the issue regarding abstain reasons during ballots.

      2. Q: Thank you for the useful background material. On the very last bullet on slide #25, I think you should add ‘at the chair’s discretion’ to clarify that point. I think that’s how other WG chairs operator.

      3. Chair: yes, the chair does have discretion, but I believe I only use discretion for family and medical emergencies etc, as opposed to someone’s technical worth.

      4. C: I certainly appreciate it, but it’s more to put that concept on the slide. I think in some of the other groups the chairs operate more by discretion.

      5. VC2: I would note that the rule says ‘may be lost’, so some flexibility is allowed.

      6. C: Sure. I just want to point out that there is no ‘hard’ rule as stated on the slide.

      7. C: One consequence of this, is that ballot results are skewed as many members just vote ‘yes’ to avoid the consequences of not voting or not providing a real abstain reason. The abstain reason for ‘lack of expertise’ has some stigma associated with it, so people tend to vote ‘yes’ instead. I would therefore like to consider extending the abstain reason and see if there is support in the group.

      8. C: This discussion has come up before. The counter argument is that the whole WG should review a draft document even if not working in that area, as opposed to abstaining for something like ‘lack of time’.

      9. C: I think that the issue of false positives (i.e. yes, as opposed to abstain) doesn’t really affect the overall process. I think the drafts are still receiving a reasonable amount of attention and comments.

      10. C: We should perhaps look at the pass criteria for early drafts, which appear to achieve the 75% approval level with the first versions, which are usually of rather poor quality.

      11. Chair: Let’s have a straw poll to consider the intent of the group.

      12. C: There’s also another aspect to consider from the report, about other WGs which leave voting status alone for all letter ballots on a single draft. In other words, their voters are maintained for the life of a project.

      13. Chair: Yes, that is a degree of freedom that we could consider.

      14. C: ok, so that’s what I meant by maintaining voting rights earlier. I also think that additionally, comment collections and re-circulation ballots don’t affect voting rights.

      15. Chair: yes, that is correct for both aspects.

      16. Straw poll: Should an “abstain” for reasons apart from “lack of technical expertise” be considered a valid to maintain voting status?

      17. Y: 34

      18. N: 4

      19. A: 9

      20. Chair: So, we now need to consider a mechanism to potentially change the current ruling within the IEEE 802 EC.

      21. C: how far back do you need to go to the last 6 initial letter ballots.

      22. Chair: I’m not really sure, but it’s probably a few years.

      23. VC1: I think we forget that the question within the letter ballot says “send the draft to sponsor ballot”? Therefore a “yes” vote may be interpreting this question literally.




    1. Modification of the agenda




      1. Move to modify the agenda to add “Allocation of legacy Element ID for UPSIM”

        1. Chair: Is there any objection to do this.

        2. None seen and the agenda is modified

        3. Move to instruct ANA to assign the number 200 for the legacy element ID for the UPSIM element.

        4. Chair: this number was previously allocated to TGaf. It was not published.

        5. C: I have spoken to the former TGaf editor who has confirmed this.

        6. Moved: Matthew Fischer, 2nd: Mike Montemurro

        7. Q; Is this the same element as on Wednesday?

        8. A: Yes.

        9. C: Is this substantially different from the motion on Wednesday?

        10. A: It’s a different motion, but on the same Element ID.

        11. C: It’s up to the chair’s discretion, as to whether we are re-visiting the topic.

        12. Chair: I rule this in order, as I think this motion substantially different. As mentioned earlier, this was a reserved ID, which was never used. Therefore I think it’s a safe re-use of the old number.

        13. C: Is this a technical or procedural motion.

        14. Chair: It is a technical motion.

        15. For: 14, Against: 4, Abstain: 26 (Motion passes)




    1. Wireless Chairs Meeting




      1. Chair: This will be at 4pm on the Sunday 15th May 2016. If you are interested in the activities of the IEEE 802 wireless WGs, please come along.




    1. May 2016 Meeting (11-16-0216r3 slide #25)




      1. Chair: Please remember that the next Interim meeting is at the Hilton Waikoloa Village, Waikoloa, HI, USA from May 17-22nd 2016. Meeting registration is now open https://802world.org/apps/session/96/register1

      2. Chair: Please note that the TGaj interim for the following week has now been cancelled, as they will now be meeting in Waikoloa, Hawaii, USA with the rest of the IEEE 802.11 membership.




    1. Adjournment




      1. Chair: having exhausted the agenda, the meeting is adjourned.

      2. The meeting adjourned at 10: 53 CST

    Annex A: Attendance & Affiliation


    Name

    Affiliation

    Attended >= 75%?

    Aboulmagd, Osama

    Huawei Technologies Co. Ltd

    Yes

    Agardh, Kare

    Sony Mobile Communications

    Yes

    Ahn, Jinsoo

    Yonsei University

    Yes

    Ahn, Woojin

    Yonsei University

    Yes

    Aldana, Carlos

    Qualcomm Incorporated

    Yes

    Alpert, Yaron

    Intel Corporation

    Yes

    Ansley, Carol

    ARRIS Group

    Yes

    Aoki, Tsuguhide

    TOSHIBA Corporation

    Yes

    Asterjadhi, Alfred

    Qualcomm Incorporated

    Yes

    Au, Kwok Shum

    Huawei Technologies Co. Ltd

    Yes

    Auluck, Vijay

    Intel Corporation

    Yes

    Awater, Geert

    Qualcomm Incorporated

    Yes

    Azizi, Shahrnaz

    Intel Corporation

    Yes

    Bagby, David

    Calypso Ventures, Inc.

    Yes

    Baik, Eugene

    Qualcomm Incorporated

    Yes

    bang, saehee

    LG ELECTRONICS

    Yes

    baron, stephane

    Canon Research Centre France

    Yes

    Barr, David

    Intel Corporation

    Yes

    Baykas, Tuncer

    Tohoku University

    No

    Berens, Friedbert

    FBConsulting Sarl

    Yes

    Bharadwaj, Arjun

    Qualcomm Incorporated

    Yes

    Bims, Harry

    Bims Laboratories, Inc.

    Yes

    Bourdoux, Andre

    IMEC

    Yes

    Brandt, David

    Rockwell Automation

    Yes

    Buffington, John

    Itron Inc.

    Yes

    Burbidge, Richard

    Intel Corporation

    No

    Calcev, George

    Huawei R&D USA

    Yes

    Canchi, Radhakrishna

    Kyocera Communications Inc.

    No

    Cao, Rui

    Marvell Semiconductor, Inc.

    Yes

    Carney, William

    Sony Corporation

    Yes

    CHANG, SANGHYUN

    SAMSUNG ELECTRONICS

    Yes

    Chang, Soo-Young

    California State University, Sacramento (CSUS)

    No

    Chen, Jiamin

    HUAWEI

    Yes

    Chen, Spark

    ARRIS Group

    Yes

    Chen, Xiaogang

    Intel Corporation

    Yes

    Cheng, Paul

    MediaTek Inc.

    Yes

    CHERIAN, GEORGE

    Qualcomm Incorporated

    Yes

    Cherniavsky, Dmitry

    SiBEAM, Inc.

    Yes

    Chitrakar, Rojan

    Panasonic Asia Pacific Pte Ltd.

    Yes

    Cho, Hangyu

    lg electronics

    Yes

    Choi, Jinsoo

    LG ELECTRONICS

    Yes

    Choi, Jinyong

    LG ELECTRONICS

    No

    Choi, Sangsung

    Electronics and Telecommunications Research Institute (ETRI)

    No

    Chu, Liwen

    Marvell Semiconductor, Inc.

    Yes

    Ciochina, Dana

    Sony Corporation

    Yes

    Coffey, John

    Realtek Semiconductor Corp.

    Yes

    Cordeiro, Carlos

    Intel Corporation

    No

    de Vegt, Rolf

    Qualcomm Incorporated

    Yes

    Debergh, Pierre

    Orange

    Yes

    Deng, Der-Jiunn

    National Changhua University of Education

    Yes

    Eastlake 3rd, Donald

    Huawei Technologies Co. Ltd

    Yes

    Ecclesine, Peter

    Cisco Systems, Inc.

    Yes

    Eitan, Alecsander

    Qualcomm Incorporated

    Yes

    Erceg, Vinko

    Broadcom Corporation

    Yes

    Evans, David

    Philips Electronics

    No

    Fang, Ping

    Huawei Technologies Co. Ltd

    Yes

    Fang, Yonggang

    ZTE TX Inc

    Yes

    Finn, Norman

    Cisco Systems, Inc.

    No

    Fischer, Matthew

    Broadcom Corporation

    Yes

    Furuichi, Sho

    Sony Corporation

    Yes

    Gan, Ming

    Huawei Technologies Co. Ltd

    Yes

    Ghosh, Chittabrata

    Intel Corporation

    Yes

    Godfrey, Tim

    Electric Power Research Institute, Inc. (EPRI)

    Yes

    Grigat, Michael

    Deutsche Telekom AG

    Yes

    Guo, Yuchen

    Huawei Technologies Co. Ltd

    Yes

    Hall, Robert

    Johnson Controls Inc

    Yes

    Halls, David

    Toshiba of Europe Ltd.

    Yes

    Hamilton, Mark

    Ruckus Wireless

    Yes

    HAN, Xiao

    Huawei Technologies Co. Ltd

    Yes

    Han, Yunbo

    HUAWEI

    Yes

    Hanatani, Yoshikazu

    TOSHIBA Corporation

    No

    Handte, Thomas

    Sony Corporation

    Yes

    Hansen, Christopher

    Peraso Technologies Incorporated

    Yes

    Harkins, Daniel

    Aruba Networks, Inc.

    Yes

    Hart, Brian

    Cisco Systems, Inc.

    Yes

    Hartman, Chris

    Apple, Inc.

    Yes

    he, shiwen

    Southeast University, China

    Yes

    Hedayat, Ahmadreza

    Newracom Inc.

    Yes

    Hiertz, Guido

    Ericsson AB

    Yes

    Holcomb, Jay

    Itron Inc.

    No

    Hong, Hanseul

    Yonsei University

    No

    Hsu, Chien-Fang

    MediaTek Inc.

    Yes

    Hu, Chunyu

    Broadcom Corporation

    Yes

    Huang, Lei

    Panasonic Asia Pacific Pte Ltd.

    Yes

    Huang, Po-Kai

    Intel Corporation

    Yes

    Huang, Rongsheng

    MediaTek Inc.

    Yes

    Huang, Zhiyong

    LitePoint Corporation/Teradyne

    Yes

    huiyi, jizhi

    Shenzhen iTest Technology Co.,Ltd.

    Yes

    Hurtarte, Jeorge

    Teradyne, Inc.

    Yes

    Inoue, Yasuhiko

    Nippon Telegraph and Telephone Corporation (NTT)

    Yes

    Ishihara, Koichi

    Nippon Telegraph and Telephone Corporation (NTT)

    Yes

    Ishizu, Kentaro

    National Institute of Information and Communications Technology (NICT)

    Yes

    Iwatani, Junichi

    Nippon Telegraph and Telephone Corporation (NTT)

    Yes

    Jeffries, Timothy

    Huawei R&D USA

    Yes

    Jia, Jia

    Huawei Technologies Co., Ltd

    Yes

    Jiang, Jinjing

    Marvell Semiconductor, Inc.

    No

    Jin, Liang

    Spirent Communications

    Yes

    Jo, Kyungtae

    LG ELECTRONICS

    Yes

    Johnsson, Kerstin

    Intel Corporation

    Yes

    Jones, Allan

    Activision

    Yes

    Jones, Vincent Knowles IV

    Qualcomm Incorporated

    Yes

    Josiam, Kaushik

    Samsung Research America

    Yes

    Kakani, Naveen

    Qualcomm Incorporated

    Yes

    Kasher, Assaf

    Intel Corporation

    Yes

    Kennedy, Richard

    HP Enterprise

    Yes

    Kerry, Stuart

    OK-Brit

    Yes

    Khorov, EVGENY

    IITP RAS

    Yes

    Khoury, Peter

    Ruckus Wireless

    Yes

    Kim, Jeongki

    LG ELECTRONICS

    Yes

    Kim, Joonsuk

    Apple, Inc.

    Yes

    Kim, Sang Gook

    LG ELECTRONICS

    Yes

    Kim, Suhwook

    LG ELECTRONICS

    Yes

    Kim, Yongho

    Korea National University of Transportation

    Yes

    Kiryanov, Anton

    IITP RAS

    Yes

    Kitazawa, Shoichi

    ATR Wave Engineering Laboratories

    No

    KNECKT, JARKKO

    Apple, Inc.

    Yes

    Ko, Geonjung

    WILUS Institute

    Yes

    Kojima, Fumihide

    National Institute of Information and Communications Technology (NICT)

    Yes

    Kondou, Keitarou

    Sony Corporation

    No

    Kotzer, Igal

    General Motors Company

    Yes

    Kulkarni, Parag

    Toshiba

    Yes

    Kumari, Warren

    Google

    Yes

    Kwak, Jin-Sam

    WILUS Institute

    Yes

    Kwon, Young Hoon

    Newracom Inc.

    Yes

    Lalam, Massinissa

    SAGEMCOM SAS

    Yes

    Lanante, Leonardo

    Kyushu Institute of Technology

    Yes

    Lansford, James

    Qualcomm Incorporated

    Yes

    Lee, Daewon

    Newracom Inc.

    Yes

    Lee, Hyeong Ho

    Electronics and Telecommunications Research Institute (ETRI)

    No

    Lee, Jae Seung

    ETRI

    Yes

    Lepp, James

    BlackBerry

    Yes

    Levy, Joseph

    InterDigital, Inc.

    Yes

    Li, Dejian

    Huawei Technologies Co. Ltd

    Yes

    Li, Huan-Bang

    National Institute of Information and Communications Technology (NICT)

    No

    Li, Jing

    Huawei Technologies Co. Ltd

    Yes

    Li, Qinghua

    Intel Corporation

    Yes

    Li, Yanchun

    Huawei Technologies Co. Ltd

    Yes

    Li, Yizhou

    HUAWEI

    No

    Li, Yunbo

    Huawei Technologies Co. Ltd

    Yes

    Lim, Dong Guk

    LG ELECTRONICS

    Yes

    Lin, Meilu

    HUAWEI

    Yes

    Lin, Wei

    Huawei Technologies Co. Ltd

    Yes

    LIU, CHENCHEN

    Huawei Technologies Co. Ltd

    Yes

    Liu, Der-Zheng

    Realtek Semiconductor Corp.

    Yes

    Liu, Fulei

    ZTE Corporation

    Yes

    Liu, Jianhan

    MediaTek Inc.

    Yes

    Liu, Jinnan

    HUAWEI

    Yes

    Liu, Yun

    Huawei Technologies Co., Ltd

    Yes

    Loc, Peter

    Huawei Technologies Co. Ltd

    Yes

    Lomayev, Artyom

    Intel Corporation

    Yes

    Luo, Zhendong

    China Academy of Telecommunication Research (CATR)

    Yes

    Lv, Kaiying

    ZTE Corporation

    Yes

    MADHAVAN, NARENDAR

    TOSHIBA Corporation

    Yes

    Maltsev, Alexander

    Intel Corporation

    Yes

    Mangold, Stefan

    Itron Inc.

    Yes

    Marks, Roger

    EthAirNet Associates

    No

    Mccann, Stephen

    BlackBerry

    Yes

    Merlin, Simone

    Qualcomm Incorporated

    Yes

    Mestanov, Filip

    Ericsson AB

    Yes

    Miao, Yannan

    Huawei Technologies Co. Ltd

    Yes

    Millet, Charles

    Analog Devices Inc.

    No

    Mobasher, Amin

    SAMSUNG

    Yes

    Mody, Apurva

    BAE Systems

    No

    Monajemi, Pooya

    Cisco Systems, Inc.

    Yes

    Montemurro, Michael

    Research In Motion Limited

    Yes

    Mori, Kenichi

    Space-Time Engineering

    Yes

    Morioka, Yuichi

    Sony Corporation

    Yes

    Motozuka, Hiroyuki

    Panasonic Corporation

    Yes

    Mueller, Robert

    Ilmenau University of Technology - TU Ilmenau

    Yes

    Murakami, Yutaka

    Panasonic Corporation

    Yes

    Myles, Andrew

    Cisco Systems, Inc.

    Yes

    Nagao, Yuhei

    Radrix Co., Ltd

    Yes

    Nakano, Hiroki

    Kyoto University

    Yes

    Nejatian, Alireza

    Ericsson AB

    No

    Nezou, Patrice

    Canon Research Centre France

    Yes

    Ng, Chun Wing Alan

    Bel Fuse

    No

    Noh, Yujin

    Newracom Inc.

    Yes

    Notor, John

    Notor Research; ARM, Inc.

    Yes

    OH, MIN-SEOK

    LG Electronics

    Yes

    Olesen, Robert

    InterDigital, Inc.

    Yes

    Oshima, Mitsuaki

    Panasonic Asia Pacific Pte Ltd.

    No

    Oteri, Oghenekome

    InterDigital, Inc.

    Yes

    Ozaki, Kazuyuki

    FUJITSU LABORATORIES LIMITED

    Yes

    Palm, Stephen

    Broadcom Corporation

    Yes

    Park, Eunsung

    LG Electronics

    Yes

    Park, Hyunhee

    LG ELECTRONICS

    Yes

    Park, Jeonghwan

    Newracom Inc.

    Yes

    Park, Minyoung

    Intel Corporation

    Yes

    Park, Sung-jin

    LG ELECTRONICS

    Yes

    Parsons, Glenn

    Ericsson AB

    No

    Peng, Xiaoming

    Institute for Infocomm Research

    Yes

    Perkins, Charles

    Futurewei Technologies

    No

    Persson, Hakan

    Ericsson AB

    Yes

    Petranovich, James

    ViaSat, Inc.

    Yes

    petrick, Albert

    Jones-Petrick and Associates, LLC.

    Yes

    Pienciak, Walter

    IEEE

    No

    porat, ron

    Broadcom Corporation

    Yes

    Qi, Emily

    Intel Corporation

    Yes

    Qiao, Dengyu

    Huawei Technologies Co. Ltd

    Yes

    Qu, Shouxing

    BlackBerry

    Yes

    Rabarijaona, Verotiana

    National Institute of Information and Communications Technology (NICT)

    No

    Rakanovic, Demir

    u-blox

    Yes

    Rayment, Stephen G

    Ericsson AB

    Yes

    Redlich, Oded

    Huawei Technologies Co. Ltd

    Yes

    Ren, Yazhen

    Huawei Technologies Co. Ltd

    Yes

    Riegel, Maximilian

    Nokia Networks

    Yes

    Rison, Mark

    Samsung Cambridge Solution Center

    Yes

    Rong, Zhigang

    Huawei Technologies Co. Ltd

    Yes

    Rosdahl, Jon

    Qualcomm Technologies Inc.

    Yes

    Ryu, Kiseon

    LG ELECTRONICS

    Yes

    Sadeghi, Bahareh

    Intel Corporation

    Yes

    sah, suprita

    Reliance JIO Infocomm LTD

    No

    Sakoda, Kazuyuki

    Sony Corporation

    Yes

    Salazar Cardozo, Ruben E

    Landis Gyr Group Worldwide

    No

    Sales, Leandro

    Federal University of Alagoas (UFAL)

    No

    Sambasivan, Sam

    AT&T

    Yes

    Sarris, Ioannis

    u-blox

    Yes

    Sasaki, Shigenobu

    Niigata University

    Yes

    Sato, Naotaka

    Sony Corporation

    Yes

    Schelstraete, Sigurd

    Quantenna Communications, Inc.

    Yes

    Segev, Jonathan

    Intel Corporation

    Yes

    Shah, Kunal

    Silver Spring Networks Inc.

    No

    Shellhammer, Stephen

    Qualcomm Incorporated

    No

    Shen, Bazhong

    Broadcom Corporation

    No

    Shen, Xia

    China Academy of Telecommunication Research (CATR)

    Yes

    Shilo, Shimi

    HUAWEI

    Yes

    Shimada, Shusaku

    Schubiquist Technologies

    Yes

    Sim, Michael

    Panasonic Corporation

    Yes

    Smith, Graham

    SR Technologies

    Yes

    Son, Ju-Hyung

    WILUS Institute

    Yes

    Sonkki, Marko

    CWC Nippon

    No

    Stacey, Robert

    Intel Corporation

    Yes

    Stanley, Dorothy

    Hewlett Packard Enterprise

    Yes

    Stephens, Adrian

    Intel Corporation

    Yes

    Stuebing, Gary

    Cisco Systems, Inc.

    No

    Sturek, Don

    Silver Spring Networks Inc.

    No

    Suh, JUNG HOON

    Huawei Technologies Co. Ltd

    Yes

    Sun, Bo

    ZTE Corporation

    Yes

    Sun, Chen

    Sony Corporation

    No

    Sun, Li-Hsiang

    InterDigital, Inc.

    Yes

    sun, sheng

    Huawei Technologies Co. Ltd

    Yes

    Sun, Yakun

    Marvell Semiconductor, Inc.

    No

    Takahashi, Kazuaki

    Panasonic Corporation

    Yes

    Tanaka, Yusuke

    Sony Corporation

    Yes

    Tao, Wu

    Huawei Technologies Co. Ltd

    Yes

    Taori, Rakesh

    SAMSUNG

    Yes

    Thaler, Patricia

    Broadcom Corporation

    No

    Tian, Bin

    Qualcomm Incorporated

    Yes

    Tong, Fei

    Samsung Cambridge Solution Center

    Yes

    TorabJahromi, Payam

    Broadcom Corporation

    Yes

    TOSHINAGA, Hideki

    NTT

    No

    Trainin, Solomon

    Intel Corporation

    Yes

    Tuomaala, Esa

    Nokia

    Yes

    Urabe, Yoshio

    Panasonic Corporation

    Yes

    Van Nee, Richard

    Qualcomm Incorporated

    Yes

    Van Zelst, Allert

    Qualcomm Incorporated

    Yes

    Vangelista, Lorenzo

    Patavina Technologies

    Yes

    Varshney, Prabodh

    Nokia

    Yes

    Venkateswaran, Sriram

    Broadcom Corporation

    Yes

    Verma, Karan

    Central University of Rajasthan

    Yes

    Vermani, Sameer

    Qualcomm Incorporated

    Yes

    Verso, Billy

    DecaWave

    No

    Wang, Bo

    Huawei Technologies Co., Ltd

    Yes

    Wang, Chao Chun

    MediaTek Inc.

    Yes

    Wang, Haiming

    Southeast University, China

    Yes

    Wang, Hao

    Fujitsu Research & Development Center

    No

    Wang, Huizhao

    Quantenna Communications, Inc.

    Yes

    Wang, James June

    MediaTek Inc.

    Yes

    Wang, Lei

    Marvell Semiconductor, Inc.

    Yes

    Wang, Xiaofei

    InterDigital, Inc.

    Yes

    Wang, Xuehuan

    Huawei Technologies Co. Ltd

    Yes

    Watanabe, Fujio

    NTT DoCoMo, Inc.

    Yes

    Wee, Gaius

    Panasonic Asia Pacific Pte Ltd.

    Yes

    Wentink, Menzo

    Qualcomm Incorporated

    Yes

    Wilhelmsson, Leif

    Ericsson AB

    Yes

    Wong, Eric

    Apple, Inc.

    Yes

    Xin, Yan

    Huawei Technologies Co. Ltd

    Yes

    Xing, Weimin

    ZTE Corporation

    Yes

    Xu, Yu

    Huawei Technologies Co. Ltd

    No

    YAGHOOBI, HASSAN

    Intel Corporation

    No

    Yang, Ou

    Intel Corporation

    Yes

    YANG, RUI

    InterDigital, Inc.

    Yes

    Yang, Xun

    Huawei Technologies Co. Ltd

    Yes

    Yang, Yunsong

    Huawei Technologies Co. Ltd

    Yes

    YAO, KE

    ZTE Corporation

    Yes

    Yee, James

    MediaTek Inc.

    Yes

    Yee, Peter

    NSA/IAD

    Yes

    Yokota, Hidetoshi

    Landis Gyr Group Worldwide

    Yes

    Yong, Su Khiong

    Apple, Inc.

    Yes

    Yu, Bo

    Marvell Semiconductor, Inc.

    Yes

    Yu, Chinghwa

    Spreadtrum Comm.

    Yes

    Yu, Jian

    Huawei Technologies Co. Ltd

    Yes

    Yu, Mao

    Marvell Semiconductor, Inc.

    Yes

    Yunoki, Katsuo

    KDDI R&D Laboratories

    Yes

    Zeng, Kun

    Huawei Technologies Co. Ltd

    Yes

    Zhang, Hongyuan

    Marvell Semiconductor, Inc.

    Yes

    Zhang, Xingxin

    Huawei Technologies Co. Ltd

    Yes

    ZHAO, XIAOWU

    ZTE Corporation

    Yes

    Zhou, Xun

    Huawei Technologies Co. Ltd

    Yes

    Zhu, Chunhui

    Huawei Technologies Co. Ltd

    Yes

    Zuniga, Juan Carlos

    InterDigital, Inc.

    Yes




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