Courese of study and scheme of assessment
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08O017 NANO SCIENCE AND TECHNOLOGY 3 0 0 3 INTRODUCTION AND CLASSIFICATION: Classification of nanostructures, nanoscale architecture – Effects of the nanometre length scale – Changes to the system total energy, changes to the system structures, vacancies in nanocrystals, dislocations in nanocrystals – Effect of nanoscale dimensions on various properties – Structural, thermal, chemical, mechanical, magnetic, optical and electronic properties – effect of nanoscale dimensions on biological systems. (8) NANOMATERIALS AND CHARACTERIZATION: Fabrication methods – Top down processes – Milling, lithographics, machining process – Bottom-up process – Vapour phase deposition methods, plasma-assisted deposition process, MBE and MOVPE, liquid phase methods, colloidal and solgel methods – Methods for templating the growth of nanomaterials – Ordering of nanosystems, self-assembly and self-organisation – Preparation, safety and storage issues. (8) GENERIC METHODOLOGIES FOR NANOTECHNOLOGY: Characterisation: General classification of characterisation methods – Analytical and imaging techniques – Microscopy techniques - Electron microscopy, scanning electron microscopy, transmission electron microscopy, STM, field ion microscopy, scanning tunnelling microscopy, atomic force microscopy – Diffraction techniques – Spectroscopy techniques – Raman spectroscopy – Surface analysis and depth profiling – Mechanical properties, electron transport properties, magnetic and thermal properties. (8) INORGANIC SEMICONDUCTOR NANOSTRUCTURES: Quantum confinement in semiconductor nanostructures - Quantum wells, quantum wires, quantum dots, superlattices, band offsets and electronic density of states – Fabrication techniques – Requirements, epitaxial growth, lithography and etching, cleared edge overgrowth – Growth on vicinal substrates, strain-induced dots and wires, electrostatically induced dots and wires, quantum well width fluctuations, thermally annealed quantum wells and self-assembly techniques. (6) SELF ASSEMBLING NANOSTRUCTURED MOLECULAR MATERIALS AND DEVICES: Introduction – Building blocks – Principles of self-assembly, non-covalent interactions, intermolecular packing, nanomotors – Self assembly methods to prepare and pattern nanoparticles – Nanopartcles from micellar and vesicular polymerization, functionalized nano particles, colloidal nanoparticles crystals, self-organizing inorganic nano particles, bio-nanoparticles – nanoobjects. (6) NANODEVICES AND THEIR VARIOUS APPLICATIONS: Nanomagnetic materials – Particulate nanomagnets and geometrical nanomagnets – Magneto resistance – Probing nanomagnetic materials – Nanomagnetism in technology – Carbon nanotubes – fabrication- applications – Organic FET, organic LED’s – Organic photovoltaics – Injection lasers, quantum cascade lasers, optical memories, electronic applications, colulomb blockade devices. (6) Total 42REFERENCES:
08O018 INTEGRATED CIRCUIT TECHNOLOGY 3 0 0 3 Integrated circuits: Monolithic integrated circuits - origin of silicon and its purification - crystal growth, doping, wafer manufacture, crystal orientation, growth of silicon dioxide, oxidation process, oxide evaluation, thickness, contamination and oxidation reaction. (8) Epitaxial deposition: Reactor - growth sequence, evaluation - impurity introduction and redistribution, diffusion – definition, process, mathematical analysis of diffusion, evaluation, ion implantation and its evaluation - non epitaxial CVD process. (8) Photolithography: Process overview – photoresist, process sequence, photomasks, wafer fabrication environment, chemicals and cleaning procedures, particle monitoring technology personal and clean room procedures. (9) IC Resistors: Sheet resistance, geometrical factors, diffused resistors, tolerance, temperature coefficient, pinch resistors, thin and thick film resistors, IC capacitors, oxide capacitors, junction capacitors, thin and thick film capacitors. (9) IC Transistors: NPN transistors, current gain, breakdown voltage, saturation voltage and resistance, leakage currents, noise, frequency response, switching transistors, PNP transistors, diodes, Zener diodes, Schottky barrier diodes, Maximum voltage, current, power and frequency. (8) Total 42 REFERENCES: 1. Peter Gise and Richard Blanchard,- "Modern Semiconductor Fabrication Technology", Prentice Hall, 1986. 2. John Allison, "Electronic Integrated Circuits-Their Technology and Design", McGraw Hill, 1975 3. Hans R Camenzind, "Electronic Integrated Systems Design", Van Nostrand Reinhold Co.,1972. 08O019 THIN FILM TECHNOLOGY 3 0 0 3 Evaporation Theory: Cosine law of emission. Emission from a point source. Mass of material condensing on the substrate. (3) Preparation of Thin Films: Chemical methods: Qualitative study of preparation of thin films by Electroplating, vapour phase growth and anodization. Physical methods: Vacuum evaporation - Study of thin film vacuum coating unit - Construction and uses of vapour sources-wire, sublimation, crucible and electron bombardment heated sources. Arc and Laser evaporation. Sputtering - Study of glow Discharge - Physical nature of sputtering - Sputtering yield - Experimental set up for DC sputtering, AC sputtering and RF sputtering. Nucleation and growth of thin films (qualitative study only): Four stages of film growth. (9) Deposition Monitoring and Control: Microbalance, Crystal oscillator thickness monitor, optical monitor, Resistance Monitor. Thickness measurement: Multiple Beam Interferometer, Fizeau (Tolansky) technique - Fringes of equal chromatic order (FECO) method - Ellipsometry (qualitative only). (8) Electrical properties: Sheet resistance - size effect - Electrical conduction in thin metallic films. Effect of Ageing and Annealing - Oxidation - Agglomeration. (5) Dielectric properties: DC conduction mechanism - Low field and high field conduction. Breakdown mechanism in dielectric films - AC conduction mechanism. Temperature dependence of conductivity. (7) Optical properties: Optical constants and their determination - Spectrophotometer method. Antireflection coatings. Interference filters. Thin film Solar Cells CuInSe2 solar cell. (5) Application of thin films: Thin film resistors: Materials and Design of thin film resistors (Choice of resistor and shape and area) - Trimming of thin film resistors - sheet resistance control - Individual resistor trimming. Thin film capacitors: Materials - Capacitor structures - Capacitor yield and capacitor stability. Thin film field effect transistors: Fabrication and characteristics - Thin film diodes. (5) Total 42 REFERENCES: 1. Rao V V, Ghosh T B, Chopra K L, "Vacuum Science and Technology", Allied Publications, 1998. 2. Goswami A, "Thin Film Fundamentals", New Age International (P) Ltd., 1996. 3. Aicha Elshabini-Riadaud Fred D Barlow III, "Thin Film Technology Hand book", Mc Graw Hill Company, 1997. 4. Maissel L I and Glang R, “Hand Book of Thin Film Technology", McGraw Hill, 1970. 5. Berry R W and others, "Thin Film Technology", Mc Graw Hill Company, 1970. 6. Chopra K L, “Thin Film Phenomena", McGraw Hill, 1969. 7. Anders H, "Thin Films in Optics", Focal press, 1967. 8. Schwartz B and Schwartz N, "Measurement Techniques for Thin Films", John Wiley & Sons, 1967. 9. Guthrie A, "Vacuum Technology” John Wiley and Sons, 1963. 10. Holland L, "Vacuum Deposition of Thin Films", Chapman and Hall, 1956. 11. Heavens O S, "Thin Film Physics", Butter worths scientific publications, 1955. 08O020 LASER TECHNOLOGY 3 0 0 3 Emission and absorption of radiation: Einstein coefficients - negative absorption, shape and width of spectral lines, spontaneous and stimulated emission. (6) Threshold condition: Rate equations - optical excitation in three and four level lasers, standing waves in a laser, cavity theory, modes, diffraction theory of the Fabry - Perot interferometer. (6) Lasers with spherical mirrors: Types of resonators, stability diagram - coherence - spatial and temporal. (5) Laser materials: Activator and host materials for solid lasers - growth techniques for solid laser materials - Bridgman and Stock-Berger technique - Czochralski and Kyropoulous techniques. (5) TYPES of lasers: (A) Gas lasers - He-Ne laser - Ar+, He-Cd+ lasers - N2 and CO2 lasers - Fabrication and excitation mechanisms. (B) Liquid lasers, dye lasers, fabrication and excitation mechanisms. (C) Solid lasers - Ruby, Nd:YAG, glass - semiconductor diode lasers, Excimer Laser , Erbium doped laser. (9) Laser Q switching: Mode-locking, second harmonic generation, theory and experiment, materials for optical SHG. (6)
Total 42 REFERENCES: 1. Sona, Gordan and Breach, "Lasers and Applications", Scientific Publishers Inc., New York, 1976. 2. Lengyel B A, "Lasers", Wiley-Inter Science, 1971. 3. Marshall S L, "Laser Technology and Applications", McGraw Hill Book Co., 1980. 4. Bloom A L, "Gas Lasers", John Wiley & Sons Inc., New York, 1968. Directory: department department -> #1 a lifesafer of virginia inc department -> Office of the collector: jagatsinghpur (st & sc development Section) department -> Town of Nags Head Annual Report department -> General information department -> Sigchi conference Proceedings Format department -> Why did they commit this attack department -> Lesson plan lp – mr7008 lp rev. No: 0 department -> National institute of technology, tiruchirappalli enclosure International Journals (sci only) department -> Neural Network controlled Shift Register Traffic Shaper for atm networks department -> Spanish program faculty Download 0.89 Mb. Share with your friends:
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