International organisation for standardisation organisation internationale de normalisation


Closing Audio Plenary and meeting deliverables



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Closing Audio Plenary and meeting deliverables

  1. Plenary discussions

  2. Responses to Liaison and NB comments


Liaison statement and NB comment responses generated by Audio were presented and approved.
    1. Recommendations for final plenary


The Audio recommendations were presented and approved.
    1. Establishment of Ad-hoc Groups


The ad-hoc groups shown in the following table were established by the Audio subgroup. Unless otherwise indicated, Ad Hoc group meetings will be held at the location of the next MPEG meeting on the weekend preceding that meeting.

No.

Title

Mtg




AHG on 3D Audio and Audio Maintenance

Yes




AhG on Responding to Industry Needs on Adoption of MPEG Audio

No
    1. Approval of output documents


All output documents, shown in Annex C, were presented in Audio plenary and were approved.
    1. Press statement


The Audio contribution to the press statement was reviewed and approved via email in closing MPEG plenary.
    1. Agenda for next meeting


The agenda for the next MPEG meeting is shown in Annex F.
    1. All other business


There was none.
    1. Closing of the meeting


The 105th Audio Subgroup meeting was adjourned Friday at 14:00 hrs.

  1. Participants


There were 36 participants in the Audio subgroup meeting, as shown in the following table.

First

Last

Country

Affiliation

Email

Akio

Ando

JP

NHK

ando.a-io@nhk.or.jp

Johannes

Boehm

DE

Technicolor

Johannes.Boehm@technicolor.com

Toru

Chinen

JP

Sony

Toru.Chinen@jp.sony.com

Sang

Chon

KR

Samsung Electronics

sb.chon@samsung.com

Oliver

Hellmuth

DE

Fraunhofer

hel@iis.fraunhofer.de

Johannes

Hilpert

DE

Fraunhofer IIS

Johannes.Hilpert@iis.fraunhofer.de

Kyeong Ok

Kang

Korea

ETRI

kokang@etri.re.kr

Namsuk

Lee

KR

Samsung Electronics

namsuk.lee@samsung.com

Taejin

Lee

KR

ETRI

tjlee@etri.re.kr

Max

Neuendorf

DE

Fraunhofer IIS

max.neuendorf@iis.fraunhofer.de

Masayuki

Nishiguchi

JP

Sony

Masayuki.Nishiguchi@jp.sony.com

Henney

Oh

KR

WILUS STRC

hooh@wilusgroup.com

Werner

Oomen

NL

Philips

werner.oomen@philips.com

Gregory

Pallone

FR

Orange

gregory.pallone@orange.com

Hochong

Park

KR

Kwangwoon University

hcpark@kw.ac.kr

Schuyler

Quackenbush

USA

ARL

srq@audioresearchlabs.com

Takehiro

Sugimoto

Japan

NHK

sugimoto.t-fg@nhk.or.jp

Jeongil

Seo

KR

ETRI

seoji@etri.re.kr

Naoya

Tanaka

JP

Panasonic

tanaka.naoya@jp.panasonic.com

Oliver

Wuebbolt

DE

Technicolor

oliver.wuebbolt@technicolor.com

Clemens

Par

Switzerland

Swissaudec

mail@swissaudec.com

Bill

Zou

USA

DTS

bill.zou@dts.com

Deep

Sen

USA

Qualcomm

dsen@ieee.org

Daniel

Fischer

Germany

Fraunhofer IIS

daniel.fischer@iis.fraunhofer.de

Thomas

Sporer

Germany

Fraunhofer IDMT

spo@idmt.fhg.de

Christof

Fersch

Germany

Dolby

christof.fersch@dolby.com

Andreas

Silzle

Germany

Fraunhofer IIS

andreas.silzle@iis.fraunhofer.de

Jan

Plogsties

Germany

Fraunhofer IIS

jan.plogsties@iis.fraunhofer.de

Yeshwant

Muthusamy

USA

Samsung Telecommunications America

y.muthusamy@sta.samsung.com

Taegyu

Lee

KR

Yonsei University

tglee@dsp.yonsei.ac.kr

Peter

Grosche

Germany

Huawei Technologies

peter.grosche@huawei.com

Sanghun

Park

KR

LG Electronics

shun.park@lge.com

Frank

Baumgarte

USA

Apple Inc.

fb@apple.com

Werner

De Bruijn

NL

Philips

werner.de.bruijn@philips.com

Panji

Setiawan

Germany

Huawei Technologies

panji.setiawan@huawei.com

Zongxian

Liu

Singapore

Panasonic R&D Center Singapore

zongxian.liu@sg.panasonic.com





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