Participating Center(s): ARC

The purpose of this subtopic is to encourage highly collaborative research and development in the area of In-Space Printable Electronics capabilities geared towards laying the foundation and infrastructure for the next generation of in-space advanced electronics manufacturing technologies. 

3D Electronics Manufacturing Hardware Miniaturization and Adaptation for Microgravity Environment including but not limited to:

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  Repackaging and modularization of commercially available state-of-the-art electronics printer platforms such as: aerosol jet, ink-jet, poly-jet, and fluidic dispensing systems.
  
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  Addition of in-line 3D scanning metrology processes to existing printer platforms.
  
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  Implementation of in-line laser and photonic sintering processes into existing electronics manufacturing platforms.
  
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  Integration of advanced robotic and automation processes into printing processes to facilitate hybrid electronic manufacturing and assembly.
  
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  Introduction of advance automated multi-material handling and delivery into electronics manufacturing processes.
  
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  Incorporation of open source flexible hardware architectures into existing printer platforms to promote highly specialized and advance electronics manufacturing solutions. 
  

Advanced Software Development for Ultimate Portability and Autonomy for use in Microgravity based 3D Electronics Printers and Manufacturing Systems:

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  Development of open-source flexible intuitive software environments and applications that integrate multiple electronic printing methodologies including but not limited to: aerosol jet, ink-jet, plasma-jet, FDM, fluidic and laser assisted dispensing.
  
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  Improving existing open-source software platforms to support advanced open electronics printer hardware configurations and architectures to support the addition of cutting-edge metrology and digital manufacturing solutions.
  
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  Introduction of advanced integrated design and manufacturing graphical user environments that support autonomous and tele-operation of 3D electronics printers and manufacturing systems.
  
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  Implementation of Graphical user-friendly utilization cataloging and database software to support organization, classification, and utilization of in-space manufactured avionics.
  
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  Development of new versatile algorithms and software processes geared towards 3D electronics printer robotic tool-path planning and routine development from inside electrical and mechanical design environment.
  
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  Advance the state-of-the-art in portable mechanical and electrical design packages for in-space manufacturing through the development of integrated electrical and mechanical design software and tools that include support for in-space multi-material avionics parts production.   
  

Phase I Objectives - Near term performance targets consist of electronics printer prototypes aimed at the in-space production of novel avionics products that are commonly based on passive electronic elements such as: resistors, capacitors, inductors, transformers, and diodes to supply on-orbit non-critical avionics parts production. Near term software targets will focus primarily on increasing portability and reliability of existing open software architectures for 3D printing to include support for in-space 3D electronics printing and multi-material advanced manufacturing processes. *Ending TRL 4 for Hardware and Software Prototypes.

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  Innovative on-demand manufacturing technologies and techniques adaptable for use in the microgravity environment (such as hybrid additive and subtractive systems or other novel manufacturing techniques).
  
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  Systems that address microgravity considerations such as debris / cutting fluid management and control of feedstock are of special interest.
  
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  Preferred feedstock materials are aerospace metal alloys, however other materials such as high strength polymers, composites, and ceramics are also of interest.
  
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  Easily scalable manufacturing technologies that can function using minimal power, mass, and volume due to operational constraints on space missions.
  

Phase I Deliverables - Feasibility study with proposed path forward to develop a full scale engineering unit in Phase II. Study should address operational constraints for system deployment on ISS such as system mass, volume, and power, as well as initial safety considerations such as material flammability, toxicity, and handling. It is desirable to have a bench top proof-of-concept/laboratory demonstration, including samples and test data, proving the proposed approach to develop an engineering unit in Phase II (TRL 3-5).

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  Sensing technologies for layer-by-layer quality confirmation.
  
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  In-process monitoring and sensing to detect off-nominal process conditions or defects.
  
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  In-process monitoring and sensing for melt pool characterization.
  
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  Predictive modeling of system response to sensing-related process changes.
  
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  Multi-physics modeling of AM process as related to monitored quantities.
  

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  Advances in process control, temperature monitoring and control, closed loop feedback, and implementing changes to the process parameters such as temperature, power, welding speed, etc.
  
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  Monitoring and controlling processing parameters in real time in order to make quality, defect-free weld joints with desired and optimal grain morphology, mechanical properties and minimal distortion.
  
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  Innovations in in-situ diagnostic and non-destructive testing technologies for solid state welding
  
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  Decoupling of the stirring, heating, and forging process elements characteristic of thermal or ultrasonic stir welding to achieve greater process control.
  

Several NASA programs are embracing metallic Additive Manufacturing (AM) technologies for their potential to increase the affordability of aerospace components by offering significant schedule and cost savings over traditional manufacturing methods. This technology is rapidly evolving and a deeper understanding of the process is needed to support certification and the use of AM hardware. The metallic AM topic area needs are concentrated on advancing the state of the art for powder bed fusion and/or directed energy wire deposition processes.

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  Surface finish improvements for internal and external AM components targeting a goal of 32 RMS; approaches may include in-situ process modifications to achieve better surface finishes directly from the AM machine, or secondary finishing approaches. The impact on total cycle time and cost from CAD to final part should be assessed as part of the justification for the approach proposed.
  
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  Linking process parameters to mechanical properties, microstructure, grain texture and grain size through empirical observations, real time process monitoring, or modeling.
  
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  In-situ assessment or process monitoring of grain size, defect detection, build anomalies, and defect repair.
  
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  Improved thermal monitoring and control hardware and methods to minimize build-to-build variations and microstructural anomalies.
  
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  Development of hardware and/or process modifications to eliminate distortion and thermal residual stresses in as-built AM parts.
  
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  Development of hardware and software tools that enable integrated CAD-to-part digital data capture, comparison, and archival for maintaining a “digital twin” correlation between parts and CAD design, slicing and tool path programming, in-process build information, secondary processing, and inspection data to document a traceable pedigree on parts for certification.
  

The goal of work supporting this area is to help build the knowledge needed to support certification of AM hardware. In the specialty materials processing area, the focus for this solicitation is on bulk metallic glasses (BMG) and BNNT reinforced MMCs. Specific areas of interest relate to optimized processing to fabricate these materials while retaining their unique microstructures and properties.

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  Achieve uniform distribution and alignment of BNNTs within the metal matrix.
  
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  Minimize the formation of brittle phases at the “reinforcing agent / metal” interface.
  

Product forms of interest include continuously- or discontinuously- reinforced nano-composites, and hybrid laminate materials. Improved processing may involve modifying incumbent methods such as powder metallurgy, melting/solidification, thermal spray, and electrochemical deposition or introduction of new method. The success of proposed processing improvements will be measured by increases in tensile strength achieved over existing alloys. Consequently, proposals must include characterization and testing of the fabricated materials.

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  Improved performance and cost from advances in composite, metallic and ceramic material systems as well as nanomaterial and nanostructures.
  
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  Improved performance and mass reduction in innovative lightweight structural systems, extreme environments structures and multifunctional/multipurpose materials and structures.
  
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  Improved cost, launch mass, system resiliency and extended life time by advancing technologies to enable large structures that can be deployed, assembled/constructed, reconfigured and serviced in-space or on planetary surfaces.
  
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  Improved life and risk mitigation to damage of structural systems by advancing technologies that enhance nondestructive evaluation and structural health monitoring.
  

The specific needs and metrics for this year’s focus technology needs are requested in detail in the topic and subtopic descriptions.

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  2500 m² total solar cell area; < 5000 kg total mass including all mechanical and electrical components; and < 20 m³ total launch volume.
  
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  Loads: 5 g axial, 2 g lateral, 145 dB OASPL for launch and 50 m/s Mars surface winds. Ideally > 1 g deployed strength to allow unconstrained Earth deployment qualification.
  
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  Capable of being optionally deployed on lander, offloaded and transported to another site, and then optionally interfaced with other power units.
  
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  Deployable/retractable at -50° C on terrain with up to 0.5 m obstacles and 15 deg slopes. Operating height > 1 m to avoid wind-blown sand collection.
  
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  Integrated dust mitigation and abatement methods. Dust accumulation is the #1 design risk issue for sustained PV power production on Mars.
  
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  Tolerant of daily thermal cycling from -100° C to 25° C over a lifetime of 10 years.
  
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  Concept of operations (ConOps) including transportation and robotic assembly aids and all design assumptions must be clearly defined.
  

This subtopic seeks innovations in the following areas for Mars solar array structures:

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  Novel packaging, deployment, retraction, dust-abatement, or in-situ manufacturing concepts.
  
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  Lightweight, compact components including booms, ribs, substrates, and mechanisms.
  
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  Optimized use of advanced ultra-lightweight materials (but not materials development).
  
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  Validated modeling, analysis, and simulation techniques.
  
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  High-fidelity, functioning laboratory models and test methods.
  

Proposals should emphasize mechanical design innovations, not PV, electrical, or energy storage innovations, although a complete solar array systems analysis is encouraged. If solar concentrators or solar tracking are proposed, strong arguments must be developed to justify why this approach is better from technical, cost, and risk points of view over fixed planar solar arrays. Of special interest are modular designs that are self-supporting in 1 g and can be autonomously deployed, retracted, relocated, and optionally interfaced with other power sources at least twice after months of operation on the Mars surface. Sharing of conceptual CAD models and analyses with NASA for mission studies, and delivery of prototype hardware to NASA at the end of Phase II for independent testing, are highly encouraged.

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  Tom Kerslake, "Solar Electric Power System Analyses for Mars Surface Missions," 1999, http://ntrs.nasa.gov/search.jsp?R=19990063893.
  
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  Robert Cataldo, "Power Requirements for NASA Mars Design Reference Architecture 5.0," 2009, http://ntrs.nasa.gov/search.jsp?R=20120012929.
  
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  Mars landing site concept animation, "Mars Exploration Zones," 2015, https://www.youtube.com/watch?v=94bIW7e1Otg&sns=em.
  

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  Innovative connection approaches/architectures that enable on-orbit geometry adaptation. Areas of interest include structural connections, electrical connections, fluid connections, thermal connections or combinations of these.
  
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  Methods for in-situ connection verification (smart joints).
  
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  Innovative reversible joining systems for robotic operations that minimize mass, energy and complexity while maximizing assembled stiffness, strength, stability, heat transfer, power density, etc.
  

Application orbits include LEO/GEO/Lunar. Nominal mechanical joining requirements are:

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  Class 1: Structural Truss Joints.
  
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    Strength: 100N to 500N axial target
    
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  Class 2: Module Joints.
  
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    Strength: > 0.4 g (Mars Extensible) with 0.25 meter cubic module connected on one face with uniform density of 640 Kg/m3.
    
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  Current from milliamp to amps per contact.
  
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    Voltage 28 to 100V DC
    
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  Assembly/Disassembly: 20-50 times.
  

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  Barnhart, David; Will, Peter; Sullivan, Brook; Hunter, Roger; and Hill, Lisa: “Creating a Sustainable Assembly Architecture for Next-Gen Space: The Phoenix Effect,” 30th Space Symposium, May 2014, Colorado Springs CO.
  
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  Erkorkmaz, Catherine; Nimelman, Menachem; and Ogilvie, Andrew: “Spacecraft Payload Modularization for Operationally Responsive Space,” 6th Responsive Space Conference, April 28-May 1, 2008, Los Angeles, CA.
  
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  Troutman, Patrick A.; Krizan, Shawn A; Mazanek, Daniel D.; Stillwagen, Frederic H.; Antol, Jeffrey; Sarver- Verhey Timothy R.; Chato, David J.; Saucillo, Rudolf J.; Blue, Douglas R.; and Carey, David: “Orbital Aggregation and Space Infrastructure Systems (OASIS)”, IAC-02-IAA.13.2.06, 53rd International Astronautical Congress, 10-19 Oct. 2002, Houston Texas.