Syllabus booklet 5-Years Integrated Dual Degree Programme

Ceramic powder synthesis methods: Solid state reaction method, chemical routes: Coprecipitation, spray drying, freeze drying, sol-gel method, hydrothermal and combustion. Microwave synthesis.

Characterzation of powders: Size and surface area.

Green Body Forming: dry pressing, slip and tape casting, extrusion, injection molding and sol-gel sintering. Hot pressing. Microwave sintering. Powder coating, flame and plasma spraying. Electrodeposition.

Point defects in ionic compounds. Effect of partial pressure of oxygen and temperature on defect concentration. Non-stoichiometry. Effect of alliovalent impurities on concentration of defects. Electronic properties of ceramic materials.

Symmetry and other criteria of ferroelectricity, ferroelectric transitions in BaTiO₃, PbTiO₃ and other related materials. Effect of compositional modifications and grain refinement. Relaxor ferroelectrics. Performance categories of ceramic capacitors with typical compositions. Powder synthesis, electroding and packaging of discrete, multilayer and barrier layer capacitors.

Symmetry considerations and equations of state for piezoelectric and electrostrictive effects. Poled ferroelectric ceramics. Measurement of coupling factor and strain coefficient. Phase diagram, preparation and properties of PZT ceramics.

Piezoelectric transducers, Motors, Piezoelectric positioners, loud speakers and gas igniters.

Pyroelectric and electro-optic ceramics and their applications.

NTC and PTC thermistors, ZnO varistors, and their applications.

1. 
   Electro ceramics: Materials, Properties, Applications, A.J. Moulson and J.M. Herbert
   
2. 
   Ferroelectric Devices, K. Uchino
   
3. 
   Ceramic Materials for Electronics; Processing, Properties, and Applications, R.C. Buchanan
   
4. 
   Piezoelectric Ceramics, B. Jaffe W.R. Cook and H. Jaffe
   

1. Ceramic Processing and Sintering, M.N. Rahman

5. OTHER SESSIONS
5.1 *TUTORIALS: 0:
5.2 *LABORATORY: 0:
5.3 *PROJECT: None:
6. ASSESSMENT (indicative only)
6.1 HA:: [xx% GRADE]
6.2 QUIZZES-HA: [xx% GRADE]
6.3 PERIODICAL EXAMS: [xx% GRADE]
6.4 *PROJECT: [xx% GRADE]
6.5 FINAL EXAM: [xx% GRADE]5. OTHER SESSIONS

7. OUTCOME OF THE COURSE:
Science of Ceramics

1. General

1.1 TITLE: Science of Ceramics

1.2 COURSE NUMBER: DE.MS405.15

1.3 CREDITS: 3-0-0 - Credit 9

1.4 SEMESTER -OFFERED: Even

1.5 Prerequisite: Physical Behaviour of Materials, Crystallography & Crystal Structures

1.6 Syllabus Committee Member: Prof. D. Pandey, Prof. R. Prakash, Prof. P.Maiti, Dr. C.Rath, Dr. A.K.Singh, Dr. C.Upadhyay, Dr. B.N.Pal

2. OBJECTIVE

To provide advanced understanding of the ceramic materials, their synthesis, properties and application.

3. COURSE CONTENT (class breakup to be discussed with AKS/DP/CR

Bonding and crystal structure of ceramics. Effect of bonding, crystal structure and microstructure on physical properties of ceramics.

Thermal expansion, thermal conductivity, thermal stresses and thermal shock resistance. Spontaneous microcracking. Thermal tempering.

1. 
   Electroceramics: Materials, Properties, Applications, A.J. Moulson and J.M. Herbert
   
2. 
   Ferroelectric Devices, K. Uchino
   
3. 
   Ceramic Materials for Electronics; Processing, Properties, and Applications, R.C. Buchanan
   
4. 
   Piezoelectric Ceramics, B. Jaffe W.R. Cook and H. Jaffe
   

1. Ceramic Processing and Sintering, M.N. Rahman

Industrial preparation of polymeric materials and structure property relationship. Uses of polymers in various industries e.g. tyre, paint, adhesive, packaging, energy, data storage, and biomedical sectors understanding the property requirement.

Origin of Polymer Science – a brief history; Classification of polymers - origin (plant based, petroleum and synthetic route), molecular architecture, and processing

Industrial preparation, structure property relationship and use of thermoset polymers (phenol-formaldehyde, amino-formaldehyde, epoxides, polyamides, polyesters and polyurethanes);

Industrial preparation, structure property relationship and use of thermoplasts (polyolefins, poly(vinyl chloride), ion exchange resin, polystyrene, poly(tetrafluoro ethylene), acrylics, polyamides, polycarbonate, polyacetal, cellulose, polyphenylene, polysulphone and polyesters);

elastomer and fibres (preparation, structure property relation, use and trade names);

1. 
   Engineering Plastic Handbook by J. M. Margolis, McGraw-Hill Company
   
2. 
   Food Packaging Principles and Practice by Gordon L. Robertson, CRC Press
   
3. 
   The Science and Technology of Rubber by J. E. Mark, B. Erman, F.R. Eirich, Elsevier
   

1. 
   Synthetic Fibres by J. E. Macintyre, Wood Head Fiber Science Series, UK
   
2. 
   Adhesion and Adhesives Technology by A. V. Pocius, H. Carl, Hanser-Verlag
   

5. OTHER SESSIONS

Large scale production of polymers used for engineering and daily use. Polymer used in various industries are highlighted with the understanding of property requirement and associated science.

To provide the knowledge about thin films, their uniqueness over the normal bulk materials. A brief knowledge about synthesis methods, properties of thin films, multilayers and hetro-structures and their applications.

Thin-Film Fabrication: Epitaxial, grain oriented and polycrysalline thin films, fundamentals of vacuum instruments. Thermal and electron beam evaporation. Sputtering methods: DC, RF and Magnetron. Laser ablation. Chemical vapour deposition. MOCVD. Electro-deposition. Molecular beam epitaxy. Langmuir–Blodgett Films.

Multilayer Materials: Strength and Toughness, Critical Thickness

Hardness of Multilayers

Stoichiometric Optimization of Physical Parameters

Ionic Solutions, Solid–Electrolyte Interface

X-ray Mirrors, Quasiperiodic Nonlinear Optical Crystals

Graphite Intercalated Compounds
4. READINGS

4.1 TEXTBOOK:

1. 
   Hand book of thin films by Maisel
   
2. 
   Thin Film by A. Goswami
   
3. 
   Materials Science of Thin Films by Milton Ohring
   
4. 
   Thin Film Materials: Stress, Defect Formation and Surface Evolution by L. B. Freund
   

1. 
   Handbook of Thin Film Deposition, by Krishna Seshan
   

5. OTHER SESSIONS

1. GENERAL

1.1 TITLE:: UG Project

1.2 *COURSE NUMBER (if known):: DP.MS391.15

1.3 CREDITS:: [0-0-5] 5 Credits

1.4 SEMESTER-OFFERED:: Sixth (IV)

1.5 PRE-REQUISITES::

2. OBJECTIVE:: The specific objectives of the course could depend on the problem definition for the project but the overall performance will be measured on the following criteria.

UNIT-I: Literature survey- Students will be having a brief literature survey on the topic selected by the allotted instructor/supervisor. A brief draft should be prepared out this activity.

UNIT-II: Problem Identification - An appropriate/feasible problem should be selected for the problem.

UNIT-III: Experimental/Theoretical work- The work needs to necessarily be novel or original. A proper strategy should be worked out to solve/explore the problem undertaken. Accordingly, experiments should be planned well in advance, executed, followed by data analysis and interpretation.

UNIT-IV: Presentation/Demonstration- A presentation should be made for the work done during the semester having clear identification of problem/s undertaken, work done, objectivity of data analysis and a summary of the important results in both a seminar and report.

A combination of the above criteria can be used to grade the work. Typically, the following guidelines could be helpful for projects taken up as part of different semesters.

Evaluation procedure: Literature Survey 25%, Experimental/Theoretical work 50%, Demonstration and Presentation 25%.

3. COURSE TOPICS:: Choice of student and the instructor.

4. READINGS 4.1

TEXTBOOK:: Instructor’s choice.

4.2 *REFERENCE BOOKS:: Instructor’s choice.

5. OTHER SESSIONS

5.1 *TUTORIALS:: No

5.2 *LABORATORY:: Yes

5.3 *PROJECT:: Yes

6. ASSESSMENT (indicative only)

6.1 HA:: [0% GRADE]

6.2 QUIZZES-HA:: [0% GRADE]

6.3 PERIODICAL EXAMS:: [0% GRADE]

6.4 *PROJECT:: [100% GRADE]

6.5 FINAL EXAM:: [0% GRADE]

7. OUTCOME OF THE COURSE:: Project goals as defined by the instructor.

1.1 TITLE: Mechanical Properties of Materials

1.2 COURSE NUMBER: DC.MS408.15

1.3 CREDITS: 3-0-0 - Credit 9

1.4 SEMESTER -OFFERED: Odd

1.5 Prerequisite: Crystallography & Crystal Structures

1.6 Syllabus Committee Member: Prof. D. Pandey, Prof. R. Prakash, Prof. P. Maiti, Dr. C. Rath, Dr. A. K. Singh, Dr. C. Upadhyay, Dr. B. N. Pal

2. OBJECTIVE

To provide basic understanding of the mechanical behavior of materials, elastic and inelastic properties of materials, role of defects and dislocations on the mechanical properties and understanding of various mechanism of strengthening of material.

Mechanical testing: Concept of stress/strain. Tensile, compression, shear, hardness and impact testing.

Measurement of stress and strain: Load cells. Optical, electrical and electronic strain measuring devices.

Nondestructive testing techniques: Ultrasonic testing. Radiography. Acoustic emission. Eddy current testing. Liquid penetration technique. Magnetic method of crack detection.

Elastic behaviour of materials: Atomic basis. Anelasticity. Thermoelastic effect. Damping capacity. Thermal expansion, Thermal stresses and thermal shock resistance.

Structural imperfections: Point defects in metals and ionic crystals. Theoretical yield strength. Dislocations and their types. Energy of dislocations, their interaction and movement in crystals. Dislocation multiplication. Dislocations in crystals. Partial dislocations and stacking faults. Role of dislocations in plastic deformation.

Plastic deformation of materials: Slip and twinning. Concept of critical resolved shear stress.

Yield point, work hardening and plastic instability. Annealing and recovery phenomena. Strengthening mechanisms: Grain refinement, solute and precipitation hardening.

Theoretical fracture strength, Griffith’s theory of brittle fracture, toughness and fracture toughness, factors influencing the strength of ceramic materials. Toughening mechanisms, transformation toughening, R-curve behaviour and designing with ceramics. Weibull modulus. Creep and fatigue in ceramics and metallic materials.

Thermal expansion, thermal conductivity, thermal stresses and thermal shock resistance. Spontaneous microcracking. Thermal tempering.

Brief Introduction of metal forming processes: Rolling, forging, extrusion, drawing and sheet metal forming.

4. READINGS

4.1 TEXTBOOK:

1. 
   Materials Science & Engineering: An Introduction, W.D. Callister. Jr.
   
2. 
   The Science and Engineering of Materials, D.R. Askeland.
   
3. 
   Mechanical Metallurgy, G.E. Dieter.
   
4. 
   Materials Science and Engineering, V. Raghavan.
   
5. 
   Engineering Materials Part 1 & 2, Ashby and D.R.H. Jones.