The first device I will introduce is the photolithography machine. First of all, we need to understand what the concept of photolithography is. Photolithography, also known as optical lithography, is a term used in integrated circuit manufacturing to describe techniques that use light to create minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer, to protect selected areas of it during subsequent etching, deposition, or implantation operations. Furthermore, photolithography procedures can be categorised based on the type of light employed, such as ultraviolet (UV lithography), extreme ultraviolet (UV lithography), or X-rays. The lowest feature size that can be impressed on the photoresist is determined by the wavelength of light employed. The photolithography procedure is divided into seven parts. Step 1 is to clean and dry the substrate surface, step 2 is to apply a layer to improve adhesion (primer), step 3 is to centrifugally coat the photosensitive layer, step 4 is to pre-dry (Soft-Bake), step 5 is to mask positioning and lighting, step 6 is to rinse, and step 7 is to dry after showing the image. Photolithography is the most prevalent technology for producing integrated circuits (also known as "electronic chips"), such as solid-state memory and microprocessors. It's also a crucial technique for creating general microstructures like microelectromechanical systems.
Sputtering machine
The sputtering machine is the next equipment I'd like to discuss. Sputtering is a physics event in which small particles of a solid substance are expelled off its surface as a result of bombardment by intense plasma or gas particles. Sputtering is a natural phenomenon that occurs frequently in outer space and causes wear and tear on the surfaces of materials aboard spacecraft and celestial bodies. Sputtering, on the other hand, can be used to bombard the surface of particular materials and create coatings with a wide range of uses in research and industry. Sputtering is carefully fine-tuned in this technique, resulting in thin film coatings for optical applications, semiconductor devices, and nanotechnology products. Cascades occur when energetic ions hit with atoms in the target substance, resulting in a momentum transfer. A collision cascade is a grouping of energy that are close together. atoms collide close to other in a solid or liquid because to an energetic particle. Crash ions cause a cascade of collisions inside the target. Some conduction is directed towards the target's surface in such impact cascades. An atom will be ejected if the cascade collides with the target's surface and its residual energy exceeds the target's surface binding energy. Sputtering is the name for this method.
