Chemical fume hood
The laboratory chemical fume hood is the most prevalent local exhaust ventilation system in use in laboratories, and it is the principal approach for limiting hazardous compound inhalation exposures. Fume hoods provide great safety for the user when used properly. The structure of a toxic fume hood usually includes:
- The motor runs the exhaust fan
- Working chamber
- Lighting system
- Lifting glass door system and mechanical structures
- Water system and sink
- Storage drawers.
A toxic fume hood is used to control the amount of poisonous gas emitted during chemical substance experiments, preventing them from dispersing into the laboratory via the slots and grooves that direct the gas flow. When toxic gas is absorbed by the cabinet, it will flow via the exhaust fan on top of the cabinet, follow the air channel through the filter, and then be released into the environment once toxins that are harmful to humans have been removed. Furthermore, the fume hood is capable of preventing spills or chemical spills in the case of an accident, as well as efficiently preventing fire.
Thermal evaporation
Thermal evaporation is a technique for making thin films that involves evaporating the materials to be created in a high vacuum environment and then condensing them on a substrate (either heated or unheated). Evaporators have a vacuum chamber that is sucked to a high level by vacuum pumps. To melt the source materials, a resistor boat is employed, and then the material is burned until it evaporates. The material that is evaporating will condense on the higher rack's bases. To control the deposition of the material on the film, the substrate is sometimes heated. A quartz transducer is used to determine the film thickness immediately during production. The fluctuation in the vibration frequency of the transducer will be proportional to the thickness of the film attached to the transducer when the evaporating film adheres to the element positioned adjacent to the substrate. Resistive thermal evaporation is used in many applications to lay metal contacts for thin-film electronics such OLEDs, solar cells, and thin-film transistors. Aluminum, silver, nickel, chromium, magnesium, and a variety of other materials can be deposited using this method.
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