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COMPUTER

TFBS6614

Si4392DY

Si7390DP

Si7392DP

SUMxxN02-xxP

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  IrDA Transceivers - FIR
  

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  WFET power MOSFETs
  

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  20-V V_DS / 20-V V_GS power MOSFETs
  

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  PowerPAK power MOSFETs
  

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  IRDC Babyface for wireless data transfer
  
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  4Mbit/s
  

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  TFBS6614 smallest FIR transceiver (2.7 mm height)
  

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  Separate Vlogic as low as 1.5 V
  
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  Excellent sensitivity
  
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  Distance range typical 1 m
  

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  1/3 the Crss for half the Qgd while maintaining excellent on-resistance
  

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  Industry’s lowest on-resistacne and lowest on-resistance-times gate-charge figure of merit
  

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  Industry’s lowest on-resistacne and lowest on-resistance-times gate-charge figure of merit in these types of thermally enhanced packages
  

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  Agilent
  

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  IR
  

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  Philips
  
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  Infineon
  
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  IR
  

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  IR
  
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  Hitachi
  
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  Fairchild
  

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  Notebook PCs
  
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  Smart phones
  
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  PDAs
  

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  High side MOSFET in synchronous buck dc-to-dc converters in notebook PCs
  

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  DC/DC converters in desktop and server applications
  

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  High and/or low side MOSFETs in synchronous buck dc-to-dc converters
  

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  VSA-PT0011-0210
  

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  VSA-PT0012-0210
  

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  VSA-PT0008-0209
  

Si7668DP

SUR50N03-09P

SUR50N03-12P

SUR50N03-16P

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  Advanced P-channel TrenchFET power MOSFETs
  

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  WFET and TrenchFET Gen II Power MOSFETs
  

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  Reverse lead DPAK Power MOSFETs
  

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  Dual N-channel 30V (D-S)
  
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  MOSFETs with Schottky diodes
  

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  Lowest on-resistance across singles and duals in –12 V, –20 V, and –30 V devices in SOT-23, TSOP-6, SO-8, PowerPAK 1212-8, TSSOP-8, and PowerPAK SO-8 packaging
  

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  The first devices utilizing both WFET and TrenchFET Gen II technology offer both low r_DS(on) and r_DS(on) x Qgd, providing low conduction and switching losses for lower power consumption and higher efficiency than competiting devices
  
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  An ultra-low QGD/QGS ratio of just 0.37 provides significant shoot-through protection
  
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  Available in SO-8 and thermally enhanced PowerPAK SO-8 packaging
  

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  By reverse forming the leads of a DPAK, the packages can be mounted inversely so a heat sink can be mounted on top. The heat sink allows the device to operate cooler, lowering effective on-resistance and allowing higher current capability.
  
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  It allows the board to operate cooler and undergo less thermal stress for better reliability.
  
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  Space and cost is saved when less MOSFETs are used.
  

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  Integrated solution for synchronous
  
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  DC/DC converter
  
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  PWM optimized
  
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  Optimized QGD/QGS ratio to prevent "shoot-thru" situation
  
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  7 A output current capability from going into a "shoot-thru" situation even when using less expensive 3 ohm drivers
  

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  IR
  
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  Fairchild
  

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  IR
  
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  SGS Thomson
  

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  IR
  
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  Fairchild
  
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  Infineon
  

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  Hitachi
  
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  IR
  
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  Fairchild
  

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  Load switches
  
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  Battery switches
  

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  Low-side MOSFET in Synchronous Buck (single and multi-phase configurations) in Notebook PCs, servers and VRM modules
  

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  Desktop core dc-to-dc conversion
  

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  Notebook PCs
  
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  Desktop computers
  
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  VGA, DDR power application
  

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  VSA-PL0007-0302
  

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  New Product Information (NPI) due out 2/04
  

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  See New Product Information (NPI)