congatec introduces the new conga-BP77 COM Express Type 2 module with 3rd generation Intel® Core™ processors
Increased computing performance and improved energy efficiency on pin-out Type 2 with PCI Express graphics (PEG) support
congatec, Inc., a leading manufacturer of embedded computer modules, adds the conga-BP77 to its portfolio of 3rd generation Intel® Core™ modules. This version is based on the COM Express Type 2 connector pin-out and supports the PCI Express graphics port for high-performance external graphics.
The conga-BP77 module is well suited to medical, gaming and multimedia applications needing high end graphics performance where the internal graphics support from the chip set does not suffice. The crucial innovations of the 3rd generation Intel® Core™ processors relate to the use of 3D trigate transistor technology, 22 nanometer production, more tightly integrated graphics and the improved PEG 3.0 graphics. The change from PEG 2.0 to PEG 3.0 is the performance increase from 5 GT/s to 8 GT/s.
Combination of New Hardware and Software Capabilities to Better Protect Data and Reduce Threats to Cloud Datacenters
Although companies are expanding their use of cloud computing to realize improved agility and efficiencies, concerns about security remains a top barrier to adoption. Today, Intel Corporation announced new collaboration with VMware and will deliver a platform for trusted cloud that combines Intel® Trusted Execution Technology (Intel® TXT) with the new release of VMware vSphere® 5.1, the leading platform for building cloud infrastructures. With hardware-enhanced security capabilities integrated into the processor, Intel TXT combined with VMware vSphere 5.1 will provide a hardened and high-integrity platform to run business-critical applications in private and public cloud environments.
DFI-ITOX EC200 T Series Supports Wide Temperature/Voltage Range
DFI-ITOX introduces the industrial grade EC200 T series system, the latest addition to DFI’s fanless embedded system family. The embedded system uses modular construction for industrial computing applications. Its unique modular-concept construction provides several I/O variations in a cable-free assembly. Virtually unlimited systems configurations are possible to meet various application requirements.
The EC200 T series supports -20°C ~ 70°C temperature suitable for users who require reliable operation in harsh environments that has uncontrolled climate. The fanless system also supports voltage range from 9V to 36V which accepts most of the popular AC adapters making it suitable for IVI application.
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