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MegaFon Announces its First Smartphone with Intel Inside®
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- Supermicro® Announces Worldwide High-Volume Availability of New FatTwin™
- The powerful Network Security Appliance with Intels 2nd Generation Core Processor for VPN, UTM, and VoIP
- AAEON Announces Fanless Pico-ITX Board with Intel® Atom™ N2600 Processor: PICO-CV01
MegaFon Announces its First Smartphone with Intel Inside®MegaFon Mint Brings High-Performance Android* Experience to Mobile Users in Russia MOSCOW – Intel Corporation and MegaFon, one of Russia's fastest- growing mobile operators, today announced the general availability of the MegaFon Mint, the first high-performance smartphone with Intel Inside for Russia. The device will be available to customers across MegaFon's retail stores and online starting Aug. 22 at a retail price of 17,990 Rubles (about US$550). The MegaFon Mint is based on Intel's Smartphone Reference Device, which includes the Intel® Atom™ processor Z2460 with Intel® Hyper-Threading Technology and HSPA+ Intel® XMM™ 6260 platform. Together these Intel solutions help to ensure fast data download speeds and a quick and responsive user experience, all while maintaining great battery life – up to 5 hours of 3G browsing, 45 hours of audio playback and 8 hours of talk time on a single charge.
"Interest in our FatTwin platform's advanced technology and operational savings has grown since our initial launch and we are excited to deliver higher compute capacity and performance along with maximum energy and cooling efficiency in volume to customers worldwide," said Charles Liang, President and CEO of Supermicro. "For high capacity needs, the 4U, 4-node FatTwin supports an impressive 8 hot-swap 3.5" HDDs per node. For high performance applications, FatTwin can be configured to support up to 135W CPUs. Our unique FatTwin architecture provides customers the lowest TCO while boosting performance and new models are just around the corner, optimized for HPC with high-density GPU support and Hadoop, big data analytics applications." The powerful Network Security Appliance with Intel's 2nd Generation Core Processor for VPN, UTM, and VoIPAcrosser Technology announces its high-end Network Security Platform AR-R6102 series. The AR-R6102 is built on Intel C206 Cougar Point platform. It delivers dependability and productivity by providing new levels of cost effective data protection, performance, expanded security, virtualization, and power management options. AR-R6102 supports scalable range of Intel® Xeon, Core i, Pentium and Celeron processors. Beside the 6 on board Giga bits Ethernet ports, it also provides two Network Interface Card (NIC) slots which are provides flexibility of accommodate up to two 4 ports Gb Ethernet, 4 ports Gb Fiber or 2 ports 10 Gb fiber NICs. The 2U version AR-R6102B has 5 more disk bay to support the RADI 0/1/5 function and provides the option of redundant power supplies. The ECC memory modules are supported for better reliability when Xeon processor is used. 
AAEON Announces Fanless Pico-ITX Board with Intel® Atom™ N2600 Processor: PICO-CV01AAEON, a leading industrial computing manufacturer, today released its latest small form factor Pico-ITX board, measuring only 100mm x 72mm, powered by the dual core 1.6GHz Intel® Atom™ N2600 low power consumption processor and Intel® NM10 express chipset. The PICO-CV01 offers high performance per watt in the compact form factor, to meet the demands of high-end industrial and various fanless embedded applications. Based on the Pico-ITX form factor, the AAEON PICO-CV01 combines a rich I/O set with great multimedia performance, supporting a mini-HDMI interface (audio/video) and onboard 18-bit single channel LVDS. The PICO-CV01 supports a DDR3 800 SODIMM up to a maximum of 2GB of memory, one SATA2.0 interface, two COM ports, five USB2.0 ports, one 4-bit DIO interface, one Gigabit Ethernet port, one half-size mini-Card that can be made to support mSATA modules for storage and one DC 12V input. This board is small but has a board thickness of 1.8mm to be more rigid to withstand the pressure exerted from the installed heatsink , and is therefore less likely to crack over time.  Directory: basecamp -> 55427 basecamp -> Assessment of Experience 55427 -> 1. Add Genivi logo to top part of article. It's not an actual figure Download 222.83 Kb. Share with your friends:
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