Project summary


The ANET Optical Network Architecture



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The ANET Optical Network Architecture


A broadcast and select approach enables ATAC communications in a simple optical network. One of the principle philosophies we have taken is to use electronics where electronics is best and optics where optics is best. All switching and routing of data is performed in the electrical domain where switching circuitry is readily implemented. Doing so eliminates the significant limitations associated with tuning in the optical domain. Further, we show that despite the broadcast nature of this network, it is highly efficient. This is because most of the power is consumed in driving the optical modulators, not in the optical power required for transmission. We refer to this broadcast and select optical network as the All-to-All Network or ANET.

The operation of an ANET region is as follows. Each ANET region contains 64 cores. Each core is assigned a wavelength channel to transmit on and enough receive elements to read all of the data being transmitted from every other core within an ANET region. Data is transmitted at the chip clock frequency, clock = 1 GHz, so as to avoid costly serialization and deserialization steps. In order to transmit a 4-byte word within a single clock cycle, 32 ANET communication lines are required. An additional 8 lines are added for address information and parity checks bringing the total number of ANET lines within an ANET region to 40. The number of connect cores is N=64 in a standard ANET region.

A more detailed design of the optical network is shown in Figure 4. Figure 4 also summarizes our estimates of optical power consumed by the network. For an ANET with 64 cores and clock = 1 GHz, the transmit bandwidth is TBW = 2.6 Tb/s and the receive bandwidth RBW =161 Tb/s. This simply indicates that because of the broadcast capability, there is a 64X multiplier on the send bandwidth. Our analysis shows that the latency of the ANET network is approximately 3ns. Approximately 0.5ns is due to optical delay and the rest is electrical. The total off-chip power consumption, as shown in Figure 4 is 2.6W. Comparisons of ANET performance with that of an electrical mesh are given in Table 1 (3 pages ahead).


Figure 4: ANET network with memory interface and layout detail for optical power coupling to chip and distribution within the ATAC network. TBW = MxNxclock = 2.5Tb/s; RBW = MxN(N-1)xclock = 161Tb/s. The power consumption of a 64-core photonic ANET is 2.6W with only 0.6W consumed on-chip.



Scaling to 4096 cores The All-to-All photonic network can be scaled to at least 4096 cores with a hierarchical structure. At 4096 cores, there will be 32-ANET0 networks and a single ANET1 network. The regional ANET0 networks connect 128 cores using 64 optical nodes (i.e. two cores share a node). The ANET0 and ANET1 connections are made via an optical-to-electrical-to-optical (OEO) on an ANET0-ANET1 interface tile. This interface tile has the function of routing the data. The aggregate performance of the photonic network is TBW =80Tb/s (transmit bandwidth) and RBW = 5000 Tb/s (i.e. 5 Pb/s) (receive bandwidth). Off-chip memory and I/O connections will be made optically as well. The power consumption of the on-chip photonic network is approximately 26W. Off-chip, memory and chip-to-chip communications are expected to add only 10-20% to this power budget due to substantially lower off-chip bandwidth requirements and to the point-to-point nature of memory connections. So, power consumption is not a major concern. The area constraints of a 2cm x 2cm chip are a bit more stringent. In order to fit the required 5.4 million devices, each device can take up no more than 75m2.

Interfaces between Digital and Optical Components

A key area of innovation in this project is the interface between traditional digital logic and the novel integrated photonic devices. This includes both the low-level details of how a digital signal is translated into an optical signal as well as the higher-level question of how the massive quantity of data received from the optical network should be screened, sorted, and buffered before it is consumed by the processor.

Figure 5 shows the path a bit takes as it is transmitted through the optical network. First, a signal stored in a flip-flop is used to activate a modulator driver (an analog electrical circuit) which, in turn, controls the optical filter/modulator component. The filter/modulator couples light of a specific wavelength from the wideband source waveguide, modulates it, and transfers it to the data waveguide. When the light passes a receiver filter, part of it is drawn off and fed into a photodetector. The photodetector outputs a small electrical signal which is then converted back to a digital bit.

Properly designing the optical components, modulator driver and circuits to receive the signal from the photodetector requires a close collaboration between the architecture and photonics groups. Since these optical components are used only to transmit digital signals, their functional requirements may be significantly different from those needed to transmit analog signals. In addition, the physical characteristics of the optical devices (e.g., size, capacitance, and manufacturing variation) greatly influence the design of the electrical interface circuits.

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Figure 5: Path of a single bit from the digital domain, through the optical network and back into digital form. Our design does not require the traditional TIA on the receive side.

ur proposed design uses a novel technique to transition from an optical signal to a digital electrical signal.  Photons that are extracted from a data waveguide by a receiver filter are routed to a photodetector whose output is directly connected to a digital logic gate.  The key to making this work is ensuring that the photodetector output is sufficient to charge the input capacitance of a digital gate to the required switching voltage. Traditionally a transimpedance amplifier (TIA) is used as the interface to convert the tiny photodetector output current to digital voltage levels.  However, TIAs are sensitive analog circuits that are difficult to design and consume large amounts of die area (500 μm2) and power (1mW) per receiver. In addition, placing these sensitive analog circuits and noisy digital circuits in close proximity decreases reliability. By using high-efficiency filters and small-footprint, waveguide-integrated photodetectors and carefully managing optical power levels, TIAs can be omitted in future process generations.  As digital circuits shrink, the input capacitances decrease and this technique becomes feasible.  Our research indicates that TIA-free designs will be practical for chips based on 22 nm and smaller process technologies.



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