The Conflict-Free Sourcing Initiative



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The Conflict-Free Sourcing Initiative
www.conflictfreesourcinginitiative.org | @EICCoalition | @GeSIConnectd:\clients\cfsi\cfsi-logo.png

To Whom It May Concern,

There are serious concerns that Tin, Tantalum, Tungsten and Gold (also referred to as 3TG or “conflict minerals”) extracted from the Democratic Republic of the Congo (DRC) and the surrounding countries is furthering conflict and extreme human rights violations.  Governments are issuing laws that require thousands of companies to publicly disclose conflict minerals in their products and whether or not those minerals are “conflict free” (e.g. United States “Dodd-Frank” released in August 2012, European Union pending legislation for 2015 release and multiple actions already taken by Central Africa countries).  Additionally, customers are demanding that products be “conflict free”.


These companies and their full supply chains are rapidly mapping the supply of conflict minerals and may be discontinuing engagement with parties that supply products or components which have not been validated as “conflict free”.  Of particular focus are smelters who represent the “choke point” in the supply chain.
The Conflict-Free Sourcing Initiative (www.conflictfreesourcing.org), which represents over 200 companies from over seven industries and several other concerned stakeholders, is requesting your immediate action to engage and be independently audited.
The Conflict-Free Sourcing Initiative provides an industry-wide solution, the Conflict-Free Smelter Program (CFSP), to validate smelter’s procurement activities and to publicly recognize them as being compliant to the CFSP protocols (http://www.conflictfreesmelter.org/cfshome.htm). Once found compliant, companies may reasonably conclude that these sources are “conflict-free”.
Your participation in the CFSP can assure your customers that you source only from DRC conflict free sources and more importantly expand your future business opportunities.
We invite you to commence participation in the CFSP as soon as possible by submitting a request to the CFS Program at info@conflictfreesmelter.org.  You may review the current status of other smelters currently participating in the CFS Program at http://www.conflictfreesourcing.org/conflict-free-smelter-refiner-lists/.
Thank you for your consideration on this matter.  This letter is signed on the behalf of the companies listed below.

Best Regards,



The Conflict Free Sourcing Initiative

  • 3M

  • AB Electrolux

  • ABB

  • Abbott Laboratories

  • Abercrombie & Fitch

  • Acbel Polytech Inc.

  • ACCO Brands

  • Acer

  • ActiGraph

  • Adobe Systems Incorporated

  • Advanced Micro Devices

  • Advanced Semiconductor Engineering

  • AGCO Corp.

  • Agilent Technologies

  • AIAG (Partner association)

  • Air Products

  • Aisin Technical Center of America

  • AIXTRON SE

  • Allegion

  • Allegro MicroSystems, LLC

  • Altera Corporation

  • Amazon.com, Inc.

  • Amdocs

  • Amkor Technology, Inc.

  • Amphenol

  • Analog Devices, Inc.

  • ANN INC.

  • A.O. Smith Corporation

  • Apogee Enterprises, Inc.

  • Apple, Inc.

  • Applied Materials

  • Arista Networks

  • ARRIS Group

  • Ashland Inc.

  • ASM International N.V.

  • ASML Holding

  • ASUSTeK Computer Inc.

  • AT&T

  • Atmel, Inc

  • Avago Technologies, Ltd.

  • Avaya

  • AVX

  • Baxter Healthcare Corporation

  • BD

  • Bell

  • BenQ

  • Best Buy

  • BlackBerry

  • Blucora

  • Boeing

  • BorgWarner, Inc.

  • BQ

  • Broadcom

  • Brocade

  • BT

  • Cadence Design Systems

  • Canon

  • Carpenter Technology Corporation

  • CAT

  • Celestica

  • Chicony Electronics Co., Ltd

  • Chrysler Group

  • Ciena

  • Cirrus Logic

  • Cisco

  • Citrix

  • CNH Industrial

  • Compal Electronics

  • Costco

  • Cree, Inc.

  • Cubic Corporation

  • Deere & Company

  • Dell Inc.

  • Delphi Automotive

  • Deluxe Corporation

  • Deutsche Telekom

  • Diebold

  • Disney

  • Dolby

  • Donaldson Company Inc.

  • Dover Corporation

  • DRS Technologies

  • Dupont

  • Eastman Chemical Company

  • Eastman Kodak Company

  • Eaton Corporation

  • EchoStar

  • Ecolab, Inc.

  • Edgewell Personal Care Company

  • Edwards Ltd

  • EIZO Corporation

  • Embraer

  • EMC Corporation

  • Emerson Electric Co.

  • Endologix

  • Energizer

  • EnerSys

  • Ericsson

  • ETNO

  • Express

  • Fabrinet

  • Fairchild Semiconductor

  • FCI

  • Federal-Mogul Corporation

  • FEI

  • Finisar

  • Flextronics International

  • Ford Motor Company

  • Foxconn

  • Freescale

  • Fresenius Medical Care AG & Co. KGaA

  • Garmin Ltd

  • Genband

  • General Electric

  • General Motors Company

  • Gentex

  • Global Advanced Metals Pty Ltd

  • GLOBALFOUNDRIES

  • Goodyear

  • GoPro

  • Griffon Corporation

  • GSI Technology

  • Halliburton

  • Harley-Davidson

  • Harris Corporation

  • Hasbro

  • HC Starck

  • HD Supply

  • Hewlett-Packard

  • Hewlett-Packard Enterprise

  • HGST

  • Honda North America, Inc.

  • Honeywell

  • HTC Corp.

  • Huawei

  • Hubbell

  • Huntington Ingalls

  • Hypertechnologies Ciara Inc.

  • IBM Corporation

  • IDEXX Laboratories, Inc.

  • Illinois Tool Works Inc.

  • Infineon Technologies

  • Infinera

  • Ingersoll Rand

  • Intel Corporation

  • International Rectifier Corporation

  • Intuit, Inc.

  • Intuitive Surgical

  • I-O

  • IPG Photonics

  • Isola Group

  • Jabil

  • JC Penney

  • JEITA (Partner association)

  • Johnson & Johnson

  • Johnson Controls, Inc.

  • Joy Global

  • Juniper Networks

  • KEA (Partner association)

  • KEMET Electronics Corp.

  • Keysight

  • KLA-Tencor

  • Knowles

  • Konica Minolta

  • KPN

  • KYE Systems Corp.

  • L-3 Communications

  • L Brands

  • Lear Corporation

  • Leggett & Platt Inc.

  • Leidos

  • Lenovo

  • Lexmark

  • LG Electronics

  • Liberty Interactive Corporation

  • Lockheed Martin

  • Logitech Inc.

  • Longwell Company



  • Macy's

  • Magna

  • Manitowoc Foodservice

  • Marvell

  • Masco Corporation

  • Maxim Integrated Products, Inc.

  • Medtronic

  • Mellanox

  • Merck & Co.

  • Methode Electronics

  • Microchip Technology Inc.

  • Micron Technology, Inc.

  • Microsoft

  • Modine Manufacturing Company

  • ModusLink

  • Molex

  • Motorola Solutions, Inc.

  • Nathan Trotter  

  • National Instruments

  • NetApp

  • NETGEAR

  • New Kinpo Group

  • Newell Rubbermaid

  • Newport Corporation 

  • NIKE

  • Nikon Corporation

  • Nokia

  • NORDAM

  • Nordson Corporation

  • Northrop Grumman

  • Nu Mark

  • Nvidia Corporation

  • NXP Semiconductors

  • O-I

  • ON Semiconductor

  • Oracle America, Inc.

  • Orange France Telecom Group

  • Oshkosh Corporation

  • OTE

  • Pace Plc

  • Palo Alto Networks

  • Panasonic

  • PCH International

  • Pegatron

  • Pentair

  • Philips

  • Plantronics

  • Plexus

  • PMC Organometallix

  • PMC-Sierra

  • Polycom

  • Power Integrations, Inc.

  • Powertech Technology Inc.

  • PPG Industries

  • Procter & Gamble Co.

  • Qorvo

  • Qualcomm

  • Quanta Computer Inc.

  • Quantum

  • QuickLogic

  • Raytheon

  • Regal Beloit Corporation

  • Remy International, Inc. 

  • Robert Bosch LLC

  • Rockwell Automation

  • Rockwell Collins

  • Roper Technologies, Inc.

  • Samsung Electronics

  • SanDisk Corporation

  • Sandvik AB

  • Sanmina-SCI

  • Seagate Technology

  • Senju Metal

  • Siemens

  • Sierra Wireless, Inc.

  • Signet Jewelers

  • SK Hynix

  • Skyworks

  • SMART Modular Technologies

  • Sony Corporation

  • Sony Mobile

  • Spansion

  • Sprint

  • Stanley Black & Decker

  • STATS ChipPAC Ltd.

  • Steelcase

  • STERIS Corporation

  • Sterling Jewelers

  • STMicroelectronics

  • Stryker

  • SunEdison

  • SunPower Corporation

  • Super Micro Computer, Inc.

  • Swisscom

  • Symantec

  • Taiwan Chinsan Electronics Industrial Co., Ltd

  • Taiwan Semiconductor Manufacturing Company, Ltd.

  • TDC Group

  • Technicolor SA

  • TE Connectivity

  • Tele2

  • Telecom Italia

  • Teleflex

  • Telefónica

  • Telenor Group

  • TeliaSonera

  • Telstra

  • Tennant Company

  • Tenneco, Inc

  • Teradata Corporation

  • Teradyne, Inc.

  • Tesla Motors

  • Texas Instruments

  • Thermo Fisher Scientific, Inc.

  • Tiffany & Co. 

  • Tokyo Electron Limited

  • TomTom International BV

  • The Toro Company

  • Toshiba Corp.

  • Toyota

  • TPV Electronics (Fujian) Co., Ltd.

  • Trimble

  • Triumph Group

  • TT Electronics Plc

  • Turk Telekom



  • Ultratech

  • United Technologies Corporation



  • VF Corporation

  • VeriFone, Inc.

  • Vertias

  • Verizon

  • Viasystems

  • ViaSat

  • VimpelCom Ltd

  • Vishay Intertechnology, Inc.

  • Visteon Corporation

  • Vodafone

  • Western Digital

  • Whirlpool

  • Wistron Corp.

  • Woodward Inc. 

  • Xerox Corporation

  • XP Power

  • Yazaki Corporation

  • Zebra Technologies Corporation

  • Zollner Elektronik AG

  • ZTE Corporation



An initiative of the Electronic Industry Citizenship Coalition and the Global e-Sustainability Initiative


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